id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
ajst-23747	Li , Lunxu	Fabricating Fine-Grained Copper Foil by Ultrafine Anode Scanning Electrodeposition without Using Additives	2024	8	.pdf	application/pdf	5782	303	48	References [1] J. Reid, Copper electrodeposition: principles and recent progress, Japanese Journal of Applied Physics, 40(4S) (2001) 2650. [14] J.J. Kelly, C. Tian, A.C. West, Leveling and microstructural effects of additives for copper electrodeposition, Journal of the Electrochemical Society, 146(7) (1999) 2540.	cache/ajst-23747.pdf	txt/ajst-23747.txt