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ap-7523	doi.org	https://doi.org/10.1049/iet-epa.2012.0319
ap-7523	doi.org	https://doi.org/10.1109/apex.2007.357705
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ap-7523	doi.org	https://doi.org/10.1016/j.conengprac.2005.12.002
ap-7523	doi.org	https://doi.org/10.1049/iet-epa.2012.0319
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ap-7523	doi.org	https://doi.org/10.1109/tmech.2005.859830
ap-7523	doi.org	https://doi.org/10.1109/tmag.2013.2263284
ap-7523	doi.org	https://doi.org/10.30880/ijie.2021.13.05.026
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ap-7523	doi.org	https://doi.org/10.1109/cdc.1989.70176
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ap-7523	doi.org	https://doi.org/10.11591/ijece.v8i5.pp3666-3677
ap-7523	doi.org	https://doi.org/10.1109/icpces.2017.8117616
ap-7523	doi.org	https://doi.org/10.1109/tie.2008.2011621
ap-7523	doi.org	https://doi.org/10.3390/electronics2030246
ap-7523	doi.org	https://doi.org/10.1109/tmech.2005.859830
ap-7523	doi.org	https://doi.org/10.1109/tmag.2013.2263284
ap-7523	doi.org	https://doi.org/10.30880/ijie.2021.13.05.026
ap-7523	doi.org	https://doi.org/10.1109/tmag.2013.2295060
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ap-7523	doi.org	https://doi.org/10.1016/0967-0661(96)00149-9
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ap-7523	doi.org	https://doi.org/10.1023/a:1024137007918
ap-7523	doi.org	https://doi.org/10.3103/s1052618820010100
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ap-7523	doi.org	https://doi.org/10.1109/icpces.2017.8117616
ap-7523	doi.org	https://doi.org/10.1109/tie.2008.2011621
ap-7523	doi.org	https://doi.org/10.3390/electronics2030246
