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app01-9364	doi.org	https://doi.org/10.14311/app.2023.41.0020
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app01-9364	doi.org	https://doi.org/10.1109/iscas.2008.4541611
app01-9364	doi.org	https://doi.org/10.1088/1741-2560/12/6/066028
app01-9364	doi.org	https://doi.org/10.1109/tase.2021.3088897
app01-9364	doi.org	https://doi.org/10.1016/j.engappai.2022.105309
app01-9364	doi.org	https://doi.org/10.1051/itmconf/20224403030
app01-9364	doi.org	https://doi.org/10.1016/j.jsr.2022.05.015
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app01-9364	doi.org	https://doi.org/10.1016/j.tcm.2019.10.010
app01-9364	doi.org	https://doi.org/10.1109/bigdata.2015.7364066
app01-9364	doi.org	https://doi.org/10.1016/j.cmpb.2020.105482
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app01-9364	doi.org	https://doi.org/10.3390/electronics10050613
app01-9364	doi.org	https://doi.org/10.1016/j.chbr.2021.100116
app01-9364	doi.org	https://doi.org/10.1109/icces51350.2021.9489076
app01-9364	doi.org	https://doi.org/10.4071/2380-4505-2019.1.000415
app01-9364	doi.org	https://doi.org/10.1016/j.apergo.2022.103855
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app01-9364	doi.org	https://doi.org/10.1109/ichms53169.2021.9582456
app01-9364	doi.org	https://doi.org/10.1109/iscas.2008.4541611
app01-9364	doi.org	https://doi.org/10.1088/1741-2560/12/6/066028
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app01-9364	doi.org	https://doi.org/10.1051/itmconf/20224403030
app01-9364	doi.org	https://doi.org/10.1016/j.jsr.2022.05.015
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app01-9364	doi.org	https://doi.org/10.1016/j.tcm.2019.10.010
app01-9364	doi.org	https://doi.org/10.1109/bigdata.2015.7364066
app01-9364	doi.org	https://doi.org/10.1016/j.cmpb.2020.105482
app01-9364	doi.org	https://doi.org/10.1109/eict54103.2021.9733564
app01-9364	doi.org	https://doi.org/10.3390/electronics10050613
app01-9364	doi.org	https://doi.org/10.1016/j.chbr.2021.100116
app01-9364	doi.org	https://doi.org/10.1109/icces51350.2021.9489076
app01-9364	doi.org	https://doi.org/10.4071/2380-4505-2019.1.000415
app01-9364	doi.org	https://doi.org/10.1016/j.apergo.2022.103855
app01-9364	doi.org	https://doi.org/10.1186/s13102-018-0098-0