id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
aiti-1026	Hsu, Hsiang-Chen; Wang, Shaw-Yuan; Chu, Li-Ming	A Study on Aluminum Pad Large Deformation during Copper Wirebonding for High Power IC Package	2018	8	.pdf	application/pdf	2984	176	63	Another issue is more bonding power and higher working temperature required in Cu wire bonding process. However, elastic modulus (E) and Poisson’s ratio (υ) at leveled working temperature for FAB and HAZ on gold wire as well as Cu wire are still scarcely known.	cache/aiti-1026.pdf	txt/aiti-1026.txt