id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
asir-55444	Pan, Steven	An Application of New 3D MCP Packaging Process for Al Wire Power Devices	2024	7	.pdf	application/pdf	1837	102	66	3.2 Stacked Package Structure Analysis Adopts stacked packaging discrete device products, and the top chip will occupy a large amount of surface pressure area space of the bottom chip. In order to meet the changing trend of packaging requirements, this paper discusses and studies a new three-dimensional MCP packaging structure that can be realized on discrete devices.	cache/asir-55444.pdf	txt/asir-55444.txt