id	sid	tid	token	lemma	pos
asir-55444	1	1	applied	apply	VERB
asir-55444	1	2	science	science	NOUN
asir-55444	1	3	and	and	CCONJ
asir-55444	1	4	innovative	innovative	ADJ
asir-55444	1	5	research	research	NOUN
asir-55444	1	6	issn	issn	VERB
asir-55444	1	7	2474	2474	NUM
asir-55444	1	8	-	-	SYM
asir-55444	1	9	4972	4972	NUM
asir-55444	1	10	(	(	PUNCT
asir-55444	1	11	print	print	NOUN
asir-55444	1	12	)	)	PUNCT
asir-55444	1	13	issn	issn	VERB
asir-55444	1	14	2474	2474	NUM
asir-55444	1	15	-	-	SYM
asir-55444	1	16	4980	4980	NUM
asir-55444	1	17	(	(	PUNCT
asir-55444	1	18	online	online	ADJ
asir-55444	1	19	)	)	PUNCT
asir-55444	1	20	vol	vol	NOUN
asir-55444	1	21	.	.	NOUN
asir-55444	1	22	8	8	NUM
asir-55444	1	23	,	,	PUNCT
asir-55444	1	24	no	no	INTJ
asir-55444	1	25	.	.	NOUN
asir-55444	1	26	4	4	NUM
asir-55444	1	27	,	,	PUNCT
asir-55444	1	28	2024	2024	NUM
asir-55444	1	29	www.scholink.org/ojs/index.php/asir	www.scholink.org/ojs/index.php/asir	NOUN
asir-55444	1	30	189	189	NUM
asir-55444	1	31	original	original	ADJ
asir-55444	1	32	paper	paper	NOUN
asir-55444	1	33	an	an	DET
asir-55444	1	34	application	application	NOUN
asir-55444	1	35	of	of	ADP
asir-55444	1	36	new	new	ADJ
asir-55444	1	37	3d	3d	PROPN
asir-55444	1	38	mcp	mcp	PROPN
asir-55444	1	39	packaging	packaging	NOUN
asir-55444	1	40	process	process	NOUN
asir-55444	1	41	for	for	ADP
asir-55444	1	42	al	al	PROPN
asir-55444	1	43	wire	wire	PROPN
asir-55444	1	44	power	power	PROPN
asir-55444	1	45	devices	devices	PROPN
asir-55444	1	46	steven	steven	PROPN
asir-55444	1	47	pan	pan	PROPN
asir-55444	1	48	jiangsu	jiangsu	PROPN
asir-55444	1	49	university	university	PROPN
asir-55444	1	50	of	of	ADP
asir-55444	1	51	science	science	NOUN
asir-55444	1	52	and	and	CCONJ
asir-55444	1	53	technology	technology	NOUN
asir-55444	1	54	,	,	PUNCT
asir-55444	1	55	jiangsu	jiangsu	PROPN
asir-55444	1	56	,	,	PUNCT
asir-55444	1	57	zhenjiang	zhenjiang	PROPN
asir-55444	1	58	,	,	PUNCT
asir-55444	1	59	china	china	PROPN
asir-55444	1	60	received	receive	VERB
asir-55444	1	61	:	:	PUNCT
asir-55444	1	62	october	october	PROPN
asir-55444	1	63	22	22	NUM
asir-55444	1	64	,	,	PUNCT
asir-55444	1	65	2024	2024	NUM
asir-55444	1	66	accepted	accept	VERB
asir-55444	1	67	:	:	PUNCT
asir-55444	1	68	november	november	PROPN
asir-55444	1	69	23	23	NUM
asir-55444	1	70	,	,	PUNCT
asir-55444	1	71	2024	2024	NUM
asir-55444	1	72	online	online	ADV
asir-55444	1	73	published	publish	VERB
asir-55444	1	74	:	:	PUNCT
asir-55444	1	75	november	november	PROPN
asir-55444	1	76	29	29	NUM
asir-55444	1	77	,	,	PUNCT
asir-55444	1	78	2024	2024	NUM
asir-55444	1	79	doi:10.22158	doi:10.22158	NOUN
asir-55444	1	80	/	/	SYM
asir-55444	1	81	asir.v8n4p189	asir.v8n4p189	NOUN
asir-55444	1	82	url	url	PROPN
asir-55444	1	83	:	:	PUNCT
asir-55444	1	84	http://doi.org/10.22158/asir.v8n4p189	http://doi.org/10.22158/asir.v8n4p189	PROPN
asir-55444	1	85	abstract	abstract	ADJ
asir-55444	1	86	traditional	traditional	ADJ
asir-55444	1	87	power	power	NOUN
asir-55444	1	88	devices	device	NOUN
asir-55444	1	89	packaging	packaging	NOUN
asir-55444	1	90	have	have	AUX
asir-55444	1	91	been	be	AUX
asir-55444	1	92	low	low	ADJ
asir-55444	1	93	package	package	NOUN
asir-55444	1	94	ratio	ratio	NOUN
asir-55444	1	95	,	,	PUNCT
asir-55444	1	96	and	and	CCONJ
asir-55444	1	97	difficult	difficult	ADJ
asir-55444	1	98	highly	highly	ADV
asir-55444	1	99	about	about	ADP
asir-55444	1	100	the	the	DET
asir-55444	1	101	characteristic	characteristic	NOUN
asir-55444	1	102	of	of	ADP
asir-55444	1	103	the	the	DET
asir-55444	1	104	integrated	integrate	VERB
asir-55444	1	105	,	,	PUNCT
asir-55444	1	106	ca	can	AUX
asir-55444	1	107	n't	not	PART
asir-55444	1	108	to	to	PART
asir-55444	1	109	adapt	adapt	VERB
asir-55444	1	110	to	to	ADP
asir-55444	1	111	the	the	DET
asir-55444	1	112	high	high	ADJ
asir-55444	1	113	integration	integration	NOUN
asir-55444	1	114	and	and	CCONJ
asir-55444	1	115	high	high	ADJ
asir-55444	1	116	density	density	NOUN
asir-55444	1	117	development	development	NOUN
asir-55444	1	118	trend	trend	NOUN
asir-55444	1	119	in	in	ADP
asir-55444	1	120	the	the	DET
asir-55444	1	121	semiconductor	semiconductor	NOUN
asir-55444	1	122	packaging	packaging	NOUN
asir-55444	1	123	industry	industry	NOUN
asir-55444	1	124	;	;	PUNCT
asir-55444	1	125	in	in	ADP
asir-55444	1	126	this	this	DET
asir-55444	1	127	paper	paper	NOUN
asir-55444	1	128	,	,	PUNCT
asir-55444	1	129	a	a	DET
asir-55444	1	130	new	new	ADJ
asir-55444	1	131	design	design	NOUN
asir-55444	1	132	of	of	ADP
asir-55444	1	133	al	al	PROPN
asir-55444	1	134	wire	wire	PROPN
asir-55444	1	135	cleaver	cleaver	NOUN
asir-55444	1	136	face	face	NOUN
asir-55444	1	137	,	,	PUNCT
asir-55444	1	138	can	can	AUX
asir-55444	1	139	form	form	VERB
asir-55444	1	140	a	a	DET
asir-55444	1	141	plane	plane	NOUN
asir-55444	1	142	on	on	ADP
asir-55444	1	143	the	the	DET
asir-55444	1	144	surface	surface	NOUN
asir-55444	1	145	of	of	ADP
asir-55444	1	146	al	al	PROPN
asir-55444	1	147	wire	wire	PROPN
asir-55444	1	148	or	or	CCONJ
asir-55444	1	149	ribbon	ribbon	NOUN
asir-55444	1	150	,	,	PUNCT
asir-55444	1	151	realize	realize	VERB
asir-55444	1	152	the	the	DET
asir-55444	1	153	second	second	ADJ
asir-55444	1	154	die	die	NOUN
asir-55444	1	155	bond	bond	NOUN
asir-55444	1	156	or	or	CCONJ
asir-55444	1	157	wire	wire	NOUN
asir-55444	1	158	bond	bond	NOUN
asir-55444	1	159	on	on	ADP
asir-55444	1	160	the	the	DET
asir-55444	1	161	surface	surface	NOUN
asir-55444	1	162	of	of	ADP
asir-55444	1	163	point	point	NOUN
asir-55444	1	164	.	.	PUNCT
asir-55444	2	1	through	through	ADP
asir-55444	2	2	the	the	DET
asir-55444	2	3	process	process	NOUN
asir-55444	2	4	to	to	PART
asir-55444	2	5	achieve	achieve	VERB
asir-55444	2	6	the	the	DET
asir-55444	2	7	idea	idea	NOUN
asir-55444	2	8	that	that	SCONJ
asir-55444	2	9	it	it	PRON
asir-55444	2	10	can	can	AUX
asir-55444	2	11	be	be	AUX
asir-55444	2	12	applied	apply	VERB
asir-55444	2	13	to	to	ADP
asir-55444	2	14	power	power	NOUN
asir-55444	2	15	devices	device	NOUN
asir-55444	2	16	of	of	ADP
asir-55444	2	17	mcp	mcp	PROPN
asir-55444	2	18	packaging	packaging	NOUN
asir-55444	2	19	technology	technology	NOUN
asir-55444	2	20	.	.	PUNCT
asir-55444	3	1	keywords	keyword	VERB
asir-55444	3	2	mcp	mcp	PROPN
asir-55444	3	3	,	,	PUNCT
asir-55444	3	4	al	al	PROPN
asir-55444	3	5	wire	wire	NOUN
asir-55444	3	6	bonding	bonding	NOUN
asir-55444	3	7	,	,	PUNCT
asir-55444	3	8	power	power	NOUN
asir-55444	3	9	device	device	NOUN
asir-55444	3	10	packaging	packaging	NOUN
asir-55444	3	11	1	1	NUM
asir-55444	3	12	.	.	PUNCT
asir-55444	4	1	introduction	introduction	NOUN
asir-55444	4	2	in	in	ADP
asir-55444	4	3	recent	recent	ADJ
asir-55444	4	4	years	year	NOUN
asir-55444	4	5	,	,	PUNCT
asir-55444	4	6	in	in	ADP
asir-55444	4	7	the	the	DET
asir-55444	4	8	semiconductor	semiconductor	NOUN
asir-55444	4	9	discrete	discrete	ADJ
asir-55444	4	10	device	device	NOUN
asir-55444	4	11	industry	industry	NOUN
asir-55444	4	12	,	,	PUNCT
asir-55444	4	13	china	china	PROPN
asir-55444	4	14	's	's	PART
asir-55444	4	15	packaging	packaging	NOUN
asir-55444	4	16	and	and	CCONJ
asir-55444	4	17	testing	testing	NOUN
asir-55444	4	18	enterprises	enterprise	NOUN
asir-55444	4	19	have	have	AUX
asir-55444	4	20	developed	develop	VERB
asir-55444	4	21	rapidly	rapidly	ADV
asir-55444	4	22	and	and	CCONJ
asir-55444	4	23	steadily	steadily	ADV
asir-55444	4	24	.	.	PUNCT
asir-55444	5	1	at	at	ADP
asir-55444	5	2	present	present	ADJ
asir-55444	5	3	,	,	PUNCT
asir-55444	5	4	they	they	PRON
asir-55444	5	5	have	have	AUX
asir-55444	5	6	occupied	occupy	VERB
asir-55444	5	7	a	a	DET
asir-55444	5	8	pivotal	pivotal	ADJ
asir-55444	5	9	position	position	NOUN
asir-55444	5	10	in	in	ADP
asir-55444	5	11	the	the	DET
asir-55444	5	12	international	international	ADJ
asir-55444	5	13	market	market	NOUN
asir-55444	5	14	.	.	PUNCT
asir-55444	6	1	with	with	ADP
asir-55444	6	2	the	the	DET
asir-55444	6	3	continuous	continuous	ADJ
asir-55444	6	4	heating	heating	NOUN
asir-55444	6	5	up	up	ADP
asir-55444	6	6	of	of	ADP
asir-55444	6	7	the	the	DET
asir-55444	6	8	electronic	electronic	ADJ
asir-55444	6	9	machine	machine	NOUN
asir-55444	6	10	,	,	PUNCT
asir-55444	6	11	consumer	consumer	NOUN
asir-55444	6	12	electronic	electronic	ADJ
asir-55444	6	13	products	product	NOUN
asir-55444	6	14	and	and	CCONJ
asir-55444	6	15	other	other	ADJ
asir-55444	6	16	markets	market	NOUN
asir-55444	6	17	,	,	PUNCT
asir-55444	6	18	in	in	ADP
asir-55444	6	19	the	the	DET
asir-55444	6	20	application	application	NOUN
asir-55444	6	21	of	of	ADP
asir-55444	6	22	electronic	electronic	ADJ
asir-55444	6	23	devices	device	NOUN
asir-55444	6	24	such	such	ADJ
asir-55444	6	25	as	as	ADP
asir-55444	6	26	high	high	ADJ
asir-55444	6	27	power	power	NOUN
asir-55444	6	28	,	,	PUNCT
asir-55444	6	29	high	high	ADJ
asir-55444	6	30	back	back	NOUN
asir-55444	6	31	pressure	pressure	NOUN
asir-55444	6	32	,	,	PUNCT
asir-55444	6	33	high	high	ADJ
asir-55444	6	34	frequency	frequency	NOUN
asir-55444	6	35	and	and	CCONJ
asir-55444	6	36	high	high	ADJ
asir-55444	6	37	speed	speed	NOUN
asir-55444	6	38	,	,	PUNCT
asir-55444	6	39	the	the	DET
asir-55444	6	40	market	market	NOUN
asir-55444	6	41	also	also	ADV
asir-55444	6	42	puts	put	VERB
asir-55444	6	43	forward	forward	ADV
asir-55444	6	44	higher	high	ADJ
asir-55444	6	45	integration	integration	NOUN
asir-55444	6	46	requirements	requirement	NOUN
asir-55444	6	47	for	for	ADP
asir-55444	6	48	traditional	traditional	ADJ
asir-55444	6	49	discrete	discrete	ADJ
asir-55444	6	50	devices	device	NOUN
asir-55444	6	51	.	.	PUNCT
asir-55444	7	1	in	in	ADP
asir-55444	7	2	order	order	NOUN
asir-55444	7	3	to	to	PART
asir-55444	7	4	meet	meet	VERB
asir-55444	7	5	the	the	DET
asir-55444	7	6	changing	change	VERB
asir-55444	7	7	trend	trend	NOUN
asir-55444	7	8	of	of	ADP
asir-55444	7	9	packaging	packaging	NOUN
asir-55444	7	10	requirements	requirement	NOUN
asir-55444	7	11	,	,	PUNCT
asir-55444	7	12	this	this	DET
asir-55444	7	13	paper	paper	NOUN
asir-55444	7	14	discusses	discuss	VERB
asir-55444	7	15	and	and	CCONJ
asir-55444	7	16	studies	study	NOUN
asir-55444	7	17	a	a	DET
asir-55444	7	18	new	new	ADJ
asir-55444	7	19	three	three	NUM
asir-55444	7	20	-	-	PUNCT
asir-55444	7	21	dimensional	dimensional	ADJ
asir-55444	7	22	mcp	mcp	PROPN
asir-55444	7	23	packaging	packaging	NOUN
asir-55444	7	24	structure	structure	NOUN
asir-55444	7	25	that	that	PRON
asir-55444	7	26	can	can	AUX
asir-55444	7	27	be	be	AUX
asir-55444	7	28	realized	realize	VERB
asir-55444	7	29	on	on	ADP
asir-55444	7	30	discrete	discrete	ADJ
asir-55444	7	31	devices	device	NOUN
asir-55444	7	32	.	.	PUNCT
asir-55444	8	1	2	2	X
asir-55444	8	2	.	.	X
asir-55444	8	3	overview	overview	NOUN
asir-55444	8	4	of	of	ADP
asir-55444	8	5	mcp	mcp	PROPN
asir-55444	8	6	packaging	packaging	NOUN
asir-55444	8	7	for	for	ADP
asir-55444	8	8	discrete	discrete	ADJ
asir-55444	8	9	devices	device	NOUN
asir-55444	8	10	from	from	ADP
asir-55444	8	11	the	the	DET
asir-55444	8	12	development	development	NOUN
asir-55444	8	13	process	process	NOUN
asir-55444	8	14	of	of	ADP
asir-55444	8	15	microelectronics	microelectronic	NOUN
asir-55444	8	16	.	.	PUNCT
asir-55444	9	1	multi	multi	ADJ
asir-55444	9	2	-	-	ADJ
asir-55444	9	3	chip	chip	ADJ
asir-55444	9	4	packaging	packaging	NOUN
asir-55444	9	5	technology	technology	NOUN
asir-55444	9	6	(	(	PUNCT
asir-55444	9	7	mcp	mcp	PROPN
asir-55444	9	8	)	)	PUNCT
asir-55444	9	9	is	be	AUX
asir-55444	9	10	a	a	DET
asir-55444	9	11	packaging	packaging	NOUN
asir-55444	9	12	process	process	NOUN
asir-55444	9	13	that	that	PRON
asir-55444	9	14	can	can	AUX
asir-55444	9	15	meet	meet	VERB
asir-55444	9	16	the	the	DET
asir-55444	9	17	requirements	requirement	NOUN
asir-55444	9	18	of	of	ADP
asir-55444	9	19	integrated	integrated	ADJ
asir-55444	9	20	density	density	NOUN
asir-55444	9	21	and	and	CCONJ
asir-55444	9	22	improve	improve	VERB
asir-55444	9	23	the	the	DET
asir-55444	9	24	performance	performance	NOUN
asir-55444	9	25	of	of	ADP
asir-55444	9	26	the	the	DET
asir-55444	9	27	whole	whole	ADJ
asir-55444	9	28	machine	machine	NOUN
asir-55444	9	29	(	(	PUNCT
asir-55444	9	30	zhang	zhang	PROPN
asir-55444	9	31	,	,	PUNCT
asir-55444	9	32	2001	2001	NUM
asir-55444	9	33	)	)	PUNCT
asir-55444	9	34	.	.	PUNCT
asir-55444	10	1	it	it	PRON
asir-55444	10	2	can	can	AUX
asir-55444	10	3	be	be	AUX
asir-55444	10	4	divided	divide	VERB
asir-55444	10	5	into	into	ADP
asir-55444	10	6	two	two	NUM
asir-55444	10	7	-	-	PUNCT
asir-55444	10	8	dimensional	dimensional	ADJ
asir-55444	10	9	(	(	PUNCT
asir-55444	10	10	2d	2d	NOUN
asir-55444	10	11	)	)	PUNCT
asir-55444	10	12	packaging	packaging	NOUN
asir-55444	10	13	and	and	CCONJ
asir-55444	10	14	www.scholink.org/ojs/index.php/asir	www.scholink.org/ojs/index.php/asir	NOUN
asir-55444	10	15	applied	apply	VERB
asir-55444	10	16	science	science	NOUN
asir-55444	10	17	and	and	CCONJ
asir-55444	10	18	innovative	innovative	ADJ
asir-55444	10	19	research	research	NOUN
asir-55444	10	20	vol	vol	NOUN
asir-55444	10	21	.	.	PROPN
asir-55444	11	1	8	8	NUM
asir-55444	11	2	,	,	PUNCT
asir-55444	11	3	no	no	INTJ
asir-55444	11	4	.	.	NOUN
asir-55444	11	5	4	4	NUM
asir-55444	11	6	,	,	PUNCT
asir-55444	11	7	2024	2024	NUM
asir-55444	11	8	190	190	NUM
asir-55444	11	9	published	publish	VERB
asir-55444	11	10	by	by	ADP
asir-55444	11	11	scholink	scholink	PROPN
asir-55444	11	12	inc	inc	PROPN
asir-55444	11	13	.	.	PROPN
asir-55444	11	14	three	three	NUM
asir-55444	11	15	-	-	PUNCT
asir-55444	11	16	dimensional	dimensional	ADJ
asir-55444	11	17	(	(	PUNCT
asir-55444	11	18	3d	3d	NOUN
asir-55444	11	19	)	)	PUNCT
asir-55444	11	20	packaging	packaging	NOUN
asir-55444	11	21	,	,	PUNCT
asir-55444	11	22	but	but	CCONJ
asir-55444	11	23	both	both	PRON
asir-55444	11	24	are	be	AUX
asir-55444	11	25	a	a	DET
asir-55444	11	26	single	single	ADJ
asir-55444	11	27	-	-	PUNCT
asir-55444	11	28	package	package	NOUN
asir-55444	11	29	hybrid	hybrid	NOUN
asir-55444	11	30	technology	technology	NOUN
asir-55444	11	31	that	that	PRON
asir-55444	11	32	combines	combine	VERB
asir-55444	11	33	multiple	multiple	ADJ
asir-55444	11	34	chips	chip	NOUN
asir-55444	11	35	in	in	ADP
asir-55444	11	36	a	a	DET
asir-55444	11	37	single	single	ADJ
asir-55444	11	38	plastic	plastic	NOUN
asir-55444	11	39	packaging	packaging	NOUN
asir-55444	11	40	shell	shell	NOUN
asir-55444	11	41	(	(	PUNCT
asir-55444	11	42	longle	longle	VERB
asir-55444	11	43	,	,	PUNCT
asir-55444	11	44	2006	2006	NUM
asir-55444	11	45	)	)	PUNCT
asir-55444	11	46	.	.	PUNCT
asir-55444	12	1	the	the	DET
asir-55444	12	2	discrete	discrete	ADJ
asir-55444	12	3	semiconductor	semiconductor	NOUN
asir-55444	12	4	device	device	NOUN
asir-55444	12	5	is	be	AUX
asir-55444	12	6	a	a	DET
asir-55444	12	7	single	single	ADJ
asir-55444	12	8	unconnected	unconnected	ADJ
asir-55444	12	9	chip	chip	NOUN
asir-55444	12	10	with	with	ADP
asir-55444	12	11	functional	functional	ADJ
asir-55444	12	12	characteristics	characteristic	NOUN
asir-55444	12	13	of	of	ADP
asir-55444	12	14	the	the	DET
asir-55444	12	15	device	device	NOUN
asir-55444	12	16	.	.	PUNCT
asir-55444	13	1	electronic	electronic	ADJ
asir-55444	13	2	device	device	NOUN
asir-55444	13	3	encapsulated	encapsulate	VERB
asir-55444	13	4	in	in	ADP
asir-55444	13	5	a	a	DET
asir-55444	13	6	shell	shell	NOUN
asir-55444	13	7	.	.	PUNCT
asir-55444	14	1	in	in	ADP
asir-55444	14	2	order	order	NOUN
asir-55444	14	3	to	to	PART
asir-55444	14	4	ensure	ensure	VERB
asir-55444	14	5	the	the	DET
asir-55444	14	6	product	product	NOUN
asir-55444	14	7	requirements	requirement	NOUN
asir-55444	14	8	of	of	ADP
asir-55444	14	9	high	high	ADJ
asir-55444	14	10	power	power	NOUN
asir-55444	14	11	and	and	CCONJ
asir-55444	14	12	high	high	ADJ
asir-55444	14	13	current	current	ADJ
asir-55444	14	14	.	.	PUNCT
asir-55444	15	1	discrete	discrete	ADJ
asir-55444	15	2	devices	device	NOUN
asir-55444	15	3	usually	usually	ADV
asir-55444	15	4	use	use	VERB
asir-55444	15	5	lead	lead	NOUN
asir-55444	15	6	-	-	PUNCT
asir-55444	15	7	tin	tin	NOUN
asir-55444	15	8	solder	solder	NOUN
asir-55444	15	9	to	to	PART
asir-55444	15	10	ensure	ensure	VERB
asir-55444	15	11	the	the	DET
asir-55444	15	12	high	high	ADJ
asir-55444	15	13	conductivity	conductivity	NOUN
asir-55444	15	14	and	and	CCONJ
asir-55444	15	15	thermal	thermal	ADJ
asir-55444	15	16	conductivity	conductivity	NOUN
asir-55444	15	17	of	of	ADP
asir-55444	15	18	the	the	DET
asir-55444	15	19	product	product	NOUN
asir-55444	15	20	.	.	PUNCT
asir-55444	16	1	the	the	DET
asir-55444	16	2	two	two	NUM
asir-55444	16	3	-	-	PUNCT
asir-55444	16	4	dimensional	dimensional	ADJ
asir-55444	16	5	packaging	packaging	NOUN
asir-55444	16	6	structure	structure	NOUN
asir-55444	16	7	shown	show	VERB
asir-55444	16	8	in	in	ADP
asir-55444	16	9	figure	figure	NOUN
asir-55444	16	10	1	1	NUM
asir-55444	16	11	is	be	AUX
asir-55444	16	12	pasted	paste	VERB
asir-55444	16	13	in	in	ADP
asir-55444	16	14	two	two	NUM
asir-55444	16	15	steps	step	NOUN
asir-55444	16	16	.	.	PUNCT
asir-55444	17	1	the	the	DET
asir-55444	17	2	bonding	bonding	NOUN
asir-55444	17	3	and	and	CCONJ
asir-55444	17	4	encapsulation	encapsulation	NOUN
asir-55444	17	5	of	of	ADP
asir-55444	17	6	aluminum	aluminum	NOUN
asir-55444	17	7	wire	wire	NOUN
asir-55444	17	8	or	or	CCONJ
asir-55444	17	9	gold	gold	NOUN
asir-55444	17	10	wire	wire	NOUN
asir-55444	17	11	were	be	AUX
asir-55444	17	12	carried	carry	VERB
asir-55444	17	13	out	out	ADP
asir-55444	17	14	in	in	ADP
asir-55444	17	15	turn	turn	NOUN
asir-55444	17	16	.	.	PUNCT
asir-55444	18	1	of	of	ADP
asir-55444	18	2	course	course	ADV
asir-55444	18	3	,	,	PUNCT
asir-55444	18	4	if	if	SCONJ
asir-55444	18	5	the	the	DET
asir-55444	18	6	integrated	integrate	VERB
asir-55444	18	7	ic	ic	NOUN
asir-55444	18	8	chip	chip	NOUN
asir-55444	18	9	no	no	DET
asir-55444	18	10	conductive	conductive	ADJ
asir-55444	18	11	thermal	thermal	ADJ
asir-55444	18	12	packaging	packaging	NOUN
asir-55444	18	13	requirements	requirement	NOUN
asir-55444	18	14	.	.	PUNCT
asir-55444	19	1	similarly	similarly	ADV
asir-55444	19	2	,	,	PUNCT
asir-55444	19	3	ic	ic	PROPN
asir-55444	19	4	chips	chip	NOUN
asir-55444	19	5	can	can	AUX
asir-55444	19	6	be	be	AUX
asir-55444	19	7	stacked	stack	VERB
asir-55444	19	8	on	on	ADP
asir-55444	19	9	top	top	NOUN
asir-55444	19	10	of	of	ADP
asir-55444	19	11	another	another	DET
asir-55444	19	12	chip	chip	NOUN
asir-55444	19	13	using	use	VERB
asir-55444	19	14	non	non	ADJ
asir-55444	19	15	conductive	conductive	ADJ
asir-55444	19	16	adhesive	adhesive	NOUN
asir-55444	19	17	.	.	PUNCT
asir-55444	20	1	as	as	SCONJ
asir-55444	20	2	shown	show	VERB
asir-55444	20	3	in	in	ADP
asir-55444	20	4	figure	figure	NOUN
asir-55444	20	5	2	2	NUM
asir-55444	20	6	,	,	PUNCT
asir-55444	20	7	the	the	DET
asir-55444	20	8	bonding	bonding	NOUN
asir-55444	20	9	and	and	CCONJ
asir-55444	20	10	encapsulation	encapsulation	NOUN
asir-55444	20	11	were	be	AUX
asir-55444	20	12	also	also	ADV
asir-55444	20	13	completed	complete	VERB
asir-55444	20	14	after	after	ADP
asir-55444	20	15	high	high	ADJ
asir-55444	20	16	temperature	temperature	NOUN
asir-55444	20	17	baking	baking	NOUN
asir-55444	20	18	.	.	PUNCT
asir-55444	21	1	figure	figure	NOUN
asir-55444	21	2	1	1	NUM
asir-55444	21	3	.	.	X
asir-55444	22	1	two	two	NUM
asir-55444	22	2	-	-	PUNCT
asir-55444	22	3	dimensional	dimensional	ADJ
asir-55444	22	4	packaging	packaging	NOUN
asir-55444	22	5	schematic	schematic	ADJ
asir-55444	22	6	of	of	ADP
asir-55444	22	7	discrete	discrete	ADJ
asir-55444	22	8	device	device	NOUN
asir-55444	22	9	mcp	mcp	PROPN
asir-55444	22	10	figure	figure	NOUN
asir-55444	22	11	2	2	NUM
asir-55444	22	12	.	.	PUNCT
asir-55444	22	13	schematic	schematic	ADJ
asir-55444	22	14	diagram	diagram	NOUN
asir-55444	22	15	of	of	ADP
asir-55444	22	16	mcp	mcp	PROPN
asir-55444	22	17	stacked	stack	VERB
asir-55444	22	18	packaging	packaging	NOUN
asir-55444	22	19	for	for	ADP
asir-55444	22	20	discrete	discrete	ADJ
asir-55444	22	21	devices	device	NOUN
asir-55444	22	22	www.scholink.org/ojs/index.php/asir	www.scholink.org/ojs/index.php/asir	NOUN
asir-55444	22	23	applied	apply	VERB
asir-55444	22	24	science	science	NOUN
asir-55444	22	25	and	and	CCONJ
asir-55444	22	26	innovative	innovative	ADJ
asir-55444	22	27	research	research	NOUN
asir-55444	22	28	vol	vol	NOUN
asir-55444	22	29	.	.	PROPN
asir-55444	23	1	8	8	NUM
asir-55444	23	2	,	,	PUNCT
asir-55444	23	3	no	no	INTJ
asir-55444	23	4	.	.	NOUN
asir-55444	23	5	4	4	NUM
asir-55444	23	6	,	,	PUNCT
asir-55444	23	7	2024	2024	NUM
asir-55444	23	8	191	191	NUM
asir-55444	23	9	published	publish	VERB
asir-55444	23	10	by	by	ADP
asir-55444	23	11	scholink	scholink	PROPN
asir-55444	23	12	inc	inc	PROPN
asir-55444	23	13	.	.	PROPN
asir-55444	23	14	3	3	X
asir-55444	23	15	.	.	X
asir-55444	24	1	analysis	analysis	NOUN
asir-55444	24	2	of	of	ADP
asir-55444	24	3	mcp	mcp	PROPN
asir-55444	24	4	packaging	packaging	NOUN
asir-55444	24	5	structure	structure	NOUN
asir-55444	24	6	of	of	ADP
asir-55444	24	7	discrete	discrete	ADJ
asir-55444	24	8	device	device	NOUN
asir-55444	24	9	with	with	ADP
asir-55444	24	10	the	the	DET
asir-55444	24	11	continuous	continuous	ADJ
asir-55444	24	12	development	development	NOUN
asir-55444	24	13	of	of	ADP
asir-55444	24	14	integrated	integrated	ADJ
asir-55444	24	15	circuits	circuit	NOUN
asir-55444	24	16	.	.	PUNCT
asir-55444	25	1	the	the	DET
asir-55444	25	2	size	size	NOUN
asir-55444	25	3	of	of	ADP
asir-55444	25	4	the	the	DET
asir-55444	25	5	chips	chip	NOUN
asir-55444	25	6	that	that	PRON
asir-55444	25	7	need	need	VERB
asir-55444	25	8	to	to	PART
asir-55444	25	9	be	be	AUX
asir-55444	25	10	integrated	integrate	VERB
asir-55444	25	11	is	be	AUX
asir-55444	25	12	getting	get	VERB
asir-55444	25	13	larger	large	ADJ
asir-55444	25	14	and	and	CCONJ
asir-55444	25	15	larger	large	ADJ
asir-55444	25	16	.	.	PUNCT
asir-55444	26	1	the	the	DET
asir-55444	26	2	above	above	ADJ
asir-55444	26	3	two	two	NUM
asir-55444	26	4	traditional	traditional	ADJ
asir-55444	26	5	discrete	discrete	ADJ
asir-55444	26	6	device	device	NOUN
asir-55444	26	7	mcp	mcp	PROPN
asir-55444	26	8	packaging	packaging	NOUN
asir-55444	26	9	technology	technology	NOUN
asir-55444	26	10	has	have	AUX
asir-55444	26	11	been	be	AUX
asir-55444	26	12	unable	unable	ADJ
asir-55444	26	13	to	to	PART
asir-55444	26	14	meet	meet	VERB
asir-55444	26	15	the	the	DET
asir-55444	26	16	higher	high	ADJ
asir-55444	26	17	requirements	requirement	NOUN
asir-55444	26	18	of	of	ADP
asir-55444	26	19	the	the	DET
asir-55444	26	20	product	product	NOUN
asir-55444	26	21	.	.	PUNCT
asir-55444	27	1	developing	develop	VERB
asir-55444	27	2	new	new	ADJ
asir-55444	27	3	packaging	packaging	NOUN
asir-55444	27	4	dimensions	dimension	NOUN
asir-55444	27	5	requires	require	VERB
asir-55444	27	6	more	more	ADJ
asir-55444	27	7	resources	resource	NOUN
asir-55444	27	8	and	and	CCONJ
asir-55444	27	9	waste	waste	NOUN
asir-55444	27	10	.	.	PUNCT
asir-55444	28	1	how	how	SCONJ
asir-55444	28	2	to	to	PART
asir-55444	28	3	develop	develop	VERB
asir-55444	28	4	new	new	ADJ
asir-55444	28	5	structures	structure	NOUN
asir-55444	28	6	and	and	CCONJ
asir-55444	28	7	processes	process	NOUN
asir-55444	28	8	on	on	ADP
asir-55444	28	9	existing	exist	VERB
asir-55444	28	10	packages	package	NOUN
asir-55444	28	11	to	to	PART
asir-55444	28	12	meet	meet	VERB
asir-55444	28	13	customer	customer	NOUN
asir-55444	28	14	needs	need	NOUN
asir-55444	28	15	.	.	PUNCT
asir-55444	29	1	it	it	PRON
asir-55444	29	2	has	have	AUX
asir-55444	29	3	become	become	VERB
asir-55444	29	4	the	the	DET
asir-55444	29	5	primary	primary	ADJ
asir-55444	29	6	problem	problem	NOUN
asir-55444	29	7	that	that	PRON
asir-55444	29	8	needs	need	VERB
asir-55444	29	9	to	to	PART
asir-55444	29	10	be	be	AUX
asir-55444	29	11	solved	solve	VERB
asir-55444	29	12	urgently	urgently	ADV
asir-55444	29	13	in	in	ADP
asir-55444	29	14	the	the	DET
asir-55444	29	15	mcp	mcp	PROPN
asir-55444	29	16	packaging	packaging	NOUN
asir-55444	29	17	process	process	NOUN
asir-55444	29	18	of	of	ADP
asir-55444	29	19	discrete	discrete	ADJ
asir-55444	29	20	devices	device	NOUN
asir-55444	29	21	.	.	PUNCT
asir-55444	30	1	3.1	3.1	NUM
asir-55444	30	2	two	two	NUM
asir-55444	30	3	-	-	PUNCT
asir-55444	30	4	dimensional	dimensional	ADJ
asir-55444	30	5	packaging	packaging	NOUN
asir-55444	30	6	structure	structure	NOUN
asir-55444	30	7	analysis	analysis	NOUN
asir-55444	30	8	the	the	DET
asir-55444	30	9	two	two	NUM
asir-55444	30	10	-	-	PUNCT
asir-55444	30	11	dimensional	dimensional	ADJ
asir-55444	30	12	packaging	packaging	NOUN
asir-55444	30	13	discrete	discrete	ADJ
asir-55444	30	14	device	device	NOUN
asir-55444	30	15	secondary	secondary	ADJ
asir-55444	30	16	chip	chip	NOUN
asir-55444	30	17	product	product	NOUN
asir-55444	30	18	by	by	ADP
asir-55444	30	19	lead	lead	NOUN
asir-55444	30	20	-	-	PUNCT
asir-55444	30	21	tin	tin	NOUN
asir-55444	30	22	wire	wire	NOUN
asir-55444	30	23	process	process	NOUN
asir-55444	30	24	.	.	PUNCT
asir-55444	31	1	the	the	DET
asir-55444	31	2	distance	distance	NOUN
asir-55444	31	3	between	between	ADP
asir-55444	31	4	the	the	DET
asir-55444	31	5	two	two	NUM
asir-55444	31	6	chips	chip	NOUN
asir-55444	31	7	is	be	AUX
asir-55444	31	8	too	too	ADV
asir-55444	31	9	close	close	ADJ
asir-55444	31	10	,	,	PUNCT
asir-55444	31	11	which	which	PRON
asir-55444	31	12	will	will	AUX
asir-55444	31	13	lead	lead	VERB
asir-55444	31	14	to	to	ADP
asir-55444	31	15	the	the	DET
asir-55444	31	16	fusion	fusion	NOUN
asir-55444	31	17	of	of	ADP
asir-55444	31	18	tin	tin	NOUN
asir-55444	31	19	beads	bead	NOUN
asir-55444	31	20	during	during	ADP
asir-55444	31	21	the	the	DET
asir-55444	31	22	tinning	tinning	NOUN
asir-55444	31	23	process	process	NOUN
asir-55444	31	24	.	.	PUNCT
asir-55444	32	1	as	as	ADP
asir-55444	32	2	a	a	DET
asir-55444	32	3	result	result	NOUN
asir-55444	32	4	,	,	PUNCT
asir-55444	32	5	the	the	DET
asir-55444	32	6	amount	amount	NOUN
asir-55444	32	7	of	of	ADP
asir-55444	32	8	tin	tin	NOUN
asir-55444	32	9	overflow	overflow	NOUN
asir-55444	32	10	around	around	ADP
asir-55444	32	11	the	the	DET
asir-55444	32	12	small	small	ADJ
asir-55444	32	13	chip	chip	NOUN
asir-55444	32	14	u2	u2	NOUN
asir-55444	32	15	is	be	AUX
asir-55444	32	16	insufficient	insufficient	ADJ
asir-55444	32	17	,	,	PUNCT
asir-55444	32	18	so	so	CCONJ
asir-55444	32	19	the	the	DET
asir-55444	32	20	u1	u1	NOUN
asir-55444	32	21	and	and	CCONJ
asir-55444	32	22	u2	u2	NOUN
asir-55444	32	23	chips	chip	NOUN
asir-55444	32	24	need	need	VERB
asir-55444	32	25	to	to	PART
asir-55444	32	26	maintain	maintain	VERB
asir-55444	32	27	a	a	DET
asir-55444	32	28	chip	chip	NOUN
asir-55444	32	29	spacing	spacing	NOUN
asir-55444	32	30	of	of	ADP
asir-55444	32	31	at	at	ADV
asir-55444	32	32	least	least	ADV
asir-55444	32	33	0.8	0.8	NUM
asir-55444	32	34	mm	mm	NOUN
asir-55444	32	35	.	.	PUNCT
asir-55444	33	1	at	at	ADP
asir-55444	33	2	the	the	DET
asir-55444	33	3	same	same	ADJ
asir-55444	33	4	time	time	NOUN
asir-55444	33	5	,	,	PUNCT
asir-55444	33	6	considering	consider	VERB
asir-55444	33	7	that	that	SCONJ
asir-55444	33	8	the	the	DET
asir-55444	33	9	chip	chip	NOUN
asir-55444	33	10	is	be	AUX
asir-55444	33	11	too	too	ADV
asir-55444	33	12	close	close	ADJ
asir-55444	33	13	to	to	ADP
asir-55444	33	14	the	the	DET
asir-55444	33	15	edge	edge	NOUN
asir-55444	33	16	of	of	ADP
asir-55444	33	17	the	the	DET
asir-55444	33	18	frame	frame	NOUN
asir-55444	33	19	base	base	NOUN
asir-55444	33	20	island	island	NOUN
asir-55444	33	21	.	.	PUNCT
asir-55444	34	1	it	it	PRON
asir-55444	34	2	will	will	AUX
asir-55444	34	3	also	also	ADV
asir-55444	34	4	lead	lead	VERB
asir-55444	34	5	to	to	ADP
asir-55444	34	6	the	the	DET
asir-55444	34	7	problem	problem	NOUN
asir-55444	34	8	that	that	SCONJ
asir-55444	34	9	the	the	DET
asir-55444	34	10	rear	rear	ADJ
asir-55444	34	11	aluminum	aluminum	NOUN
asir-55444	34	12	wire	wire	NOUN
asir-55444	34	13	bonding	bonding	NOUN
asir-55444	34	14	claw	claw	NOUN
asir-55444	34	15	can	can	AUX
asir-55444	34	16	not	not	PART
asir-55444	34	17	be	be	AUX
asir-55444	34	18	placed	place	VERB
asir-55444	34	19	and	and	CCONJ
asir-55444	34	20	the	the	DET
asir-55444	34	21	solder	solder	NOUN
asir-55444	34	22	overflows	overflow	VERB
asir-55444	34	23	the	the	DET
asir-55444	34	24	side	side	NOUN
asir-55444	34	25	of	of	ADP
asir-55444	34	26	the	the	DET
asir-55444	34	27	frame	frame	NOUN
asir-55444	34	28	base	base	NOUN
asir-55444	34	29	island	island	NOUN
asir-55444	34	30	.	.	PUNCT
asir-55444	35	1	therefore	therefore	ADV
asir-55444	35	2	,	,	PUNCT
asir-55444	35	3	the	the	DET
asir-55444	35	4	distance	distance	NOUN
asir-55444	35	5	between	between	ADP
asir-55444	35	6	the	the	DET
asir-55444	35	7	chip	chip	NOUN
asir-55444	35	8	and	and	CCONJ
asir-55444	35	9	the	the	DET
asir-55444	35	10	edge	edge	NOUN
asir-55444	35	11	of	of	ADP
asir-55444	35	12	the	the	DET
asir-55444	35	13	frame	frame	NOUN
asir-55444	35	14	base	base	NOUN
asir-55444	35	15	island	island	NOUN
asir-55444	35	16	needs	need	VERB
asir-55444	35	17	to	to	PART
asir-55444	35	18	be	be	AUX
asir-55444	35	19	set	set	VERB
asir-55444	35	20	aside	aside	ADV
asir-55444	35	21	more	more	ADJ
asir-55444	35	22	than	than	ADP
asir-55444	35	23	0.5	0.5	NUM
asir-55444	35	24	mm	mm	NOUN
asir-55444	35	25	.	.	PUNCT
asir-55444	36	1	therefore	therefore	ADV
asir-55444	36	2	,	,	PUNCT
asir-55444	36	3	the	the	DET
asir-55444	36	4	packaging	packaging	NOUN
asir-55444	36	5	ratio	ratio	NOUN
asir-55444	36	6	of	of	ADP
asir-55444	36	7	two	two	NUM
asir-55444	36	8	-	-	PUNCT
asir-55444	36	9	dimensional	dimensional	ADJ
asir-55444	36	10	packaging	packaging	NOUN
asir-55444	36	11	structure	structure	NOUN
asir-55444	36	12	is	be	AUX
asir-55444	36	13	seriously	seriously	ADV
asir-55444	36	14	limited	limit	VERB
asir-55444	36	15	,	,	PUNCT
asir-55444	36	16	which	which	PRON
asir-55444	36	17	can	can	AUX
asir-55444	36	18	not	not	PART
asir-55444	36	19	meet	meet	VERB
asir-55444	36	20	the	the	DET
asir-55444	36	21	increasing	increase	VERB
asir-55444	36	22	packaging	packaging	NOUN
asir-55444	36	23	requirements	requirement	NOUN
asir-55444	36	24	of	of	ADP
asir-55444	36	25	chip	chip	NOUN
asir-55444	36	26	size	size	NOUN
asir-55444	36	27	.	.	PUNCT
asir-55444	37	1	3.2	3.2	NUM
asir-55444	37	2	stacked	stack	VERB
asir-55444	37	3	package	package	NOUN
asir-55444	37	4	structure	structure	NOUN
asir-55444	37	5	analysis	analysis	NOUN
asir-55444	37	6	adopts	adopt	VERB
asir-55444	37	7	stacked	stack	VERB
asir-55444	37	8	packaging	packaging	NOUN
asir-55444	37	9	discrete	discrete	ADJ
asir-55444	37	10	device	device	NOUN
asir-55444	37	11	products	product	NOUN
asir-55444	37	12	,	,	PUNCT
asir-55444	37	13	and	and	CCONJ
asir-55444	37	14	the	the	DET
asir-55444	37	15	top	top	ADJ
asir-55444	37	16	chip	chip	NOUN
asir-55444	37	17	will	will	AUX
asir-55444	37	18	occupy	occupy	VERB
asir-55444	37	19	a	a	DET
asir-55444	37	20	large	large	ADJ
asir-55444	37	21	amount	amount	NOUN
asir-55444	37	22	of	of	ADP
asir-55444	37	23	surface	surface	NOUN
asir-55444	37	24	pressure	pressure	NOUN
asir-55444	37	25	area	area	NOUN
asir-55444	37	26	space	space	NOUN
asir-55444	37	27	of	of	ADP
asir-55444	37	28	the	the	DET
asir-55444	37	29	bottom	bottom	ADJ
asir-55444	37	30	chip	chip	NOUN
asir-55444	37	31	.	.	PUNCT
asir-55444	38	1	when	when	SCONJ
asir-55444	38	2	the	the	DET
asir-55444	38	3	on	on	ADP
asir-55444	38	4	-	-	PUNCT
asir-55444	38	5	current	current	ADJ
asir-55444	38	6	ids	id	NOUN
asir-55444	38	7	of	of	ADP
asir-55444	38	8	discrete	discrete	ADJ
asir-55444	38	9	power	power	NOUN
asir-55444	38	10	devices	device	NOUN
asir-55444	38	11	is	be	AUX
asir-55444	38	12	small	small	ADJ
asir-55444	38	13	,	,	PUNCT
asir-55444	38	14	only	only	ADV
asir-55444	38	15	a	a	DET
asir-55444	38	16	thick	thick	ADJ
asir-55444	38	17	aluminum	aluminum	NOUN
asir-55444	38	18	wire	wire	NOUN
asir-55444	38	19	is	be	AUX
asir-55444	38	20	usually	usually	ADV
asir-55444	38	21	needed	need	VERB
asir-55444	38	22	to	to	PART
asir-55444	38	23	connect	connect	VERB
asir-55444	38	24	the	the	DET
asir-55444	38	25	pad	pad	NOUN
asir-55444	38	26	of	of	ADP
asir-55444	38	27	the	the	DET
asir-55444	38	28	chip	chip	NOUN
asir-55444	38	29	and	and	CCONJ
asir-55444	38	30	the	the	DET
asir-55444	38	31	lead	lead	ADJ
asir-55444	38	32	frame	frame	NOUN
asir-55444	38	33	.	.	PUNCT
asir-55444	39	1	however	however	ADV
asir-55444	39	2	,	,	PUNCT
asir-55444	39	3	with	with	ADP
asir-55444	39	4	the	the	DET
asir-55444	39	5	increasing	increase	VERB
asir-55444	39	6	demand	demand	NOUN
asir-55444	39	7	for	for	ADP
asir-55444	39	8	current	current	ADJ
asir-55444	39	9	processing	processing	NOUN
asir-55444	39	10	capability	capability	NOUN
asir-55444	39	11	of	of	ADP
asir-55444	39	12	power	power	NOUN
asir-55444	39	13	devices	device	NOUN
asir-55444	39	14	.	.	PUNCT
asir-55444	40	1	the	the	DET
asir-55444	40	2	conduction	conduction	NOUN
asir-55444	40	3	current	current	NOUN
asir-55444	40	4	of	of	ADP
asir-55444	40	5	the	the	DET
asir-55444	40	6	device	device	NOUN
asir-55444	40	7	becomes	become	VERB
asir-55444	40	8	larger	large	ADJ
asir-55444	40	9	and	and	CCONJ
asir-55444	40	10	larger	large	ADJ
asir-55444	40	11	.	.	PUNCT
asir-55444	41	1	at	at	ADP
asir-55444	41	2	this	this	DET
asir-55444	41	3	time	time	NOUN
asir-55444	41	4	,	,	PUNCT
asir-55444	41	5	a	a	DET
asir-55444	41	6	thick	thick	ADJ
asir-55444	41	7	aluminum	aluminum	NOUN
asir-55444	41	8	wire	wire	NOUN
asir-55444	41	9	is	be	AUX
asir-55444	41	10	not	not	PART
asir-55444	41	11	enough	enough	ADJ
asir-55444	41	12	to	to	PART
asir-55444	41	13	conduct	conduct	VERB
asir-55444	41	14	higher	high	ADJ
asir-55444	41	15	and	and	CCONJ
asir-55444	41	16	higher	high	ADJ
asir-55444	41	17	currents	current	NOUN
asir-55444	41	18	,	,	PUNCT
asir-55444	41	19	and	and	CCONJ
asir-55444	41	20	multiple	multiple	ADJ
asir-55444	41	21	thick	thick	ADJ
asir-55444	41	22	aluminum	aluminum	NOUN
asir-55444	41	23	wires	wire	NOUN
asir-55444	41	24	or	or	CCONJ
asir-55444	41	25	thicker	thick	ADJ
asir-55444	41	26	aluminum	aluminum	NOUN
asir-55444	41	27	wires	wire	NOUN
asir-55444	41	28	will	will	AUX
asir-55444	41	29	be	be	AUX
asir-55444	41	30	used	use	VERB
asir-55444	41	31	to	to	PART
asir-55444	41	32	meet	meet	VERB
asir-55444	41	33	product	product	NOUN
asir-55444	41	34	requirements	requirement	NOUN
asir-55444	41	35	.	.	PUNCT
asir-55444	42	1	after	after	ADP
asir-55444	42	2	using	use	VERB
asir-55444	42	3	the	the	DET
asir-55444	42	4	stacked	stack	VERB
asir-55444	42	5	packaging	packaging	NOUN
asir-55444	42	6	structure	structure	NOUN
asir-55444	42	7	design	design	NOUN
asir-55444	42	8	.	.	PUNCT
asir-55444	43	1	the	the	DET
asir-55444	43	2	weldable	weldable	ADJ
asir-55444	43	3	area	area	NOUN
asir-55444	43	4	on	on	ADP
asir-55444	43	5	the	the	DET
asir-55444	43	6	bottom	bottom	ADJ
asir-55444	43	7	chip	chip	NOUN
asir-55444	43	8	surface	surface	NOUN
asir-55444	43	9	can	can	AUX
asir-55444	43	10	not	not	PART
asir-55444	43	11	meet	meet	VERB
asir-55444	43	12	the	the	DET
asir-55444	43	13	welding	welding	NOUN
asir-55444	43	14	requirements	requirement	NOUN
asir-55444	43	15	of	of	ADP
asir-55444	43	16	multiple	multiple	ADJ
asir-55444	43	17	aluminum	aluminum	NOUN
asir-55444	43	18	wires	wire	NOUN
asir-55444	43	19	or	or	CCONJ
asir-55444	43	20	aluminum	aluminum	NOUN
asir-55444	43	21	strips	strip	NOUN
asir-55444	43	22	,	,	PUNCT
asir-55444	43	23	and	and	CCONJ
asir-55444	43	24	thus	thus	ADV
asir-55444	43	25	can	can	AUX
asir-55444	43	26	not	not	PART
asir-55444	43	27	meet	meet	VERB
asir-55444	43	28	the	the	DET
asir-55444	43	29	electrical	electrical	ADJ
asir-55444	43	30	requirements	requirement	NOUN
asir-55444	43	31	of	of	ADP
asir-55444	43	32	the	the	DET
asir-55444	43	33	product	product	NOUN
asir-55444	43	34	.	.	PUNCT
asir-55444	44	1	4	4	X
asir-55444	44	2	.	.	X
asir-55444	44	3	packaging	packaging	NOUN
asir-55444	44	4	structure	structure	NOUN
asir-55444	44	5	and	and	CCONJ
asir-55444	44	6	process	process	NOUN
asir-55444	44	7	optimization	optimization	NOUN
asir-55444	44	8	the	the	DET
asir-55444	44	9	main	main	ADJ
asir-55444	44	10	problem	problem	NOUN
asir-55444	44	11	of	of	ADP
asir-55444	44	12	the	the	DET
asir-55444	44	13	mcp	mcp	PROPN
asir-55444	44	14	packaging	packaging	NOUN
asir-55444	44	15	structure	structure	NOUN
asir-55444	44	16	is	be	AUX
asir-55444	44	17	the	the	DET
asir-55444	44	18	design	design	NOUN
asir-55444	44	19	of	of	ADP
asir-55444	44	20	the	the	DET
asir-55444	44	21	internal	internal	ADJ
asir-55444	44	22	space	space	NOUN
asir-55444	44	23	of	of	ADP
asir-55444	44	24	the	the	DET
asir-55444	44	25	package	package	NOUN
asir-55444	44	26	,	,	PUNCT
asir-55444	44	27	that	that	ADV
asir-55444	44	28	is	is	ADV
asir-55444	44	29	,	,	PUNCT
asir-55444	44	30	the	the	DET
asir-55444	44	31	use	use	NOUN
asir-55444	44	32	of	of	ADP
asir-55444	44	33	stacked	stack	VERB
asir-55444	44	34	packaging	packaging	NOUN
asir-55444	44	35	structure	structure	NOUN
asir-55444	44	36	without	without	ADP
asir-55444	44	37	affecting	affect	VERB
asir-55444	44	38	the	the	DET
asir-55444	44	39	electrical	electrical	ADJ
asir-55444	44	40	requirements	requirement	NOUN
asir-55444	44	41	of	of	ADP
asir-55444	44	42	the	the	DET
asir-55444	44	43	product	product	NOUN
asir-55444	44	44	.	.	PUNCT
asir-55444	45	1	aluminum	aluminum	NOUN
asir-55444	45	2	wire	wire	NOUN
asir-55444	45	3	solder	solder	NOUN
asir-55444	45	4	joints	joint	NOUN
asir-55444	45	5	with	with	ADP
asir-55444	45	6	high	high	ADJ
asir-55444	45	7	space	space	NOUN
asir-55444	45	8	ratio	ratio	NOUN
asir-55444	45	9	can	can	AUX
asir-55444	45	10	be	be	AUX
asir-55444	45	11	utilized	utilize	VERB
asir-55444	45	12	.	.	PUNCT
asir-55444	46	1	adhesively	adhesively	ADV
asir-55444	46	2	on	on	ADP
asir-55444	46	3	its	its	PRON
asir-55444	46	4	surface	surface	NOUN
asir-55444	46	5	twice	twice	ADV
asir-55444	46	6	.	.	PUNCT
asir-55444	47	1	however	however	ADV
asir-55444	47	2	,	,	PUNCT
asir-55444	47	3	it	it	PRON
asir-55444	47	4	is	be	AUX
asir-55444	47	5	necessary	necessary	ADJ
asir-55444	47	6	to	to	PART
asir-55444	47	7	consider	consider	VERB
asir-55444	47	8	the	the	DET
asir-55444	47	9	height	height	NOUN
asir-55444	47	10	of	of	ADP
asir-55444	47	11	the	the	DET
asir-55444	47	12	packaging	packaging	NOUN
asir-55444	47	13	structure	structure	NOUN
asir-55444	47	14	,	,	PUNCT
asir-55444	47	15	the	the	DET
asir-55444	47	16	design	design	NOUN
asir-55444	47	17	of	of	ADP
asir-55444	47	18	the	the	DET
asir-55444	47	19	end	end	NOUN
asir-55444	47	20	face	face	NOUN
asir-55444	47	21	of	of	ADP
asir-55444	47	22	the	the	DET
asir-55444	47	23	steel	steel	NOUN
asir-55444	47	24	nozzle	nozzle	NOUN
asir-55444	47	25	and	and	CCONJ
asir-55444	47	26	the	the	DET
asir-55444	47	27	feasibility	feasibility	NOUN
asir-55444	47	28	of	of	ADP
asir-55444	47	29	the	the	DET
asir-55444	47	30	process	process	NOUN
asir-55444	47	31	flow	flow	NOUN
asir-55444	47	32	.	.	PUNCT
asir-55444	48	1	www.scholink.org/ojs/index.php/asir	www.scholink.org/ojs/index.php/asir	PROPN
asir-55444	48	2	applied	apply	VERB
asir-55444	48	3	science	science	NOUN
asir-55444	48	4	and	and	CCONJ
asir-55444	48	5	innovative	innovative	ADJ
asir-55444	48	6	research	research	NOUN
asir-55444	48	7	vol	vol	NOUN
asir-55444	48	8	.	.	PROPN
asir-55444	49	1	8	8	NUM
asir-55444	49	2	,	,	PUNCT
asir-55444	49	3	no	no	INTJ
asir-55444	49	4	.	.	NOUN
asir-55444	49	5	4	4	NUM
asir-55444	49	6	,	,	PUNCT
asir-55444	49	7	2024	2024	NUM
asir-55444	49	8	192	192	NUM
asir-55444	49	9	published	publish	VERB
asir-55444	49	10	by	by	ADP
asir-55444	49	11	scholink	scholink	PROPN
asir-55444	49	12	inc	inc	PROPN
asir-55444	49	13	.	.	PROPN
asir-55444	49	14	4.1	4.1	NUM
asir-55444	49	15	packaging	packaging	NOUN
asir-55444	49	16	structure	structure	NOUN
asir-55444	49	17	height	height	NOUN
asir-55444	49	18	problem	problem	NOUN
asir-55444	49	19	at	at	ADP
asir-55444	49	20	present	present	NOUN
asir-55444	49	21	,	,	PUNCT
asir-55444	49	22	the	the	DET
asir-55444	49	23	discrete	discrete	ADJ
asir-55444	49	24	device	device	NOUN
asir-55444	49	25	packaging	packaging	NOUN
asir-55444	49	26	mainly	mainly	ADV
asir-55444	49	27	includes	include	VERB
asir-55444	49	28	to-220	to-220	PROPN
asir-55444	49	29	,	,	PUNCT
asir-55444	49	30	to-247	to-247	PROPN
asir-55444	49	31	,	,	PUNCT
asir-55444	49	32	to-252	to-252	NOUN
asir-55444	49	33	and	and	CCONJ
asir-55444	49	34	other	other	ADJ
asir-55444	49	35	structures	structure	NOUN
asir-55444	49	36	.	.	PUNCT
asir-55444	50	1	from	from	ADP
asir-55444	50	2	the	the	DET
asir-55444	50	3	discrete	discrete	ADJ
asir-55444	50	4	device	device	NOUN
asir-55444	50	5	packaging	packaging	NOUN
asir-55444	50	6	altimeter	altimeter	NOUN
asir-55444	50	7	shown	show	VERB
asir-55444	50	8	in	in	ADP
asir-55444	50	9	table	table	NOUN
asir-55444	50	10	1	1	NUM
asir-55444	50	11	,	,	PUNCT
asir-55444	50	12	it	it	PRON
asir-55444	50	13	can	can	AUX
asir-55444	50	14	be	be	AUX
asir-55444	50	15	seen	see	VERB
asir-55444	50	16	that	that	SCONJ
asir-55444	50	17	the	the	DET
asir-55444	50	18	packaging	packaging	NOUN
asir-55444	50	19	height	height	NOUN
asir-55444	50	20	is	be	AUX
asir-55444	50	21	above	above	ADP
asir-55444	50	22	1800	1800	NUM
asir-55444	50	23	um	um	INTJ
asir-55444	50	24	after	after	ADP
asir-55444	50	25	deducting	deduct	VERB
asir-55444	50	26	the	the	DET
asir-55444	50	27	frame	frame	NOUN
asir-55444	50	28	thickness	thickness	NOUN
asir-55444	50	29	.	.	PUNCT
asir-55444	51	1	deduct	deduct	NOUN
asir-55444	51	2	250	250	NUM
asir-55444	51	3	um	um	INTJ
asir-55444	51	4	conventional	conventional	ADJ
asir-55444	51	5	solder	solder	NOUN
asir-55444	51	6	joint	joint	ADJ
asir-55444	51	7	height	height	NOUN
asir-55444	51	8	.	.	PUNCT
asir-55444	52	1	the	the	DET
asir-55444	52	2	remaining	remain	VERB
asir-55444	52	3	height	height	NOUN
asir-55444	52	4	is	be	AUX
asir-55444	52	5	above	above	ADP
asir-55444	52	6	1500	1500	NUM
asir-55444	52	7	um	um	INTJ
asir-55444	52	8	,	,	PUNCT
asir-55444	52	9	and	and	CCONJ
asir-55444	52	10	the	the	DET
asir-55444	52	11	conventional	conventional	ADJ
asir-55444	52	12	chip	chip	NOUN
asir-55444	52	13	thickness	thickness	NOUN
asir-55444	52	14	is	be	AUX
asir-55444	52	15	300	300	NUM
asir-55444	52	16	um	um	INTJ
asir-55444	52	17	.	.	PUNCT
asir-55444	53	1	after	after	ADP
asir-55444	53	2	deducting	deduct	VERB
asir-55444	53	3	the	the	DET
asir-55444	53	4	height	height	NOUN
asir-55444	53	5	of	of	ADP
asir-55444	53	6	the	the	DET
asir-55444	53	7	two	two	NUM
asir-55444	53	8	chips	chip	NOUN
asir-55444	53	9	,	,	PUNCT
asir-55444	53	10	the	the	DET
asir-55444	53	11	900	900	NUM
asir-55444	53	12	um	um	INTJ
asir-55444	53	13	height	height	NOUN
asir-55444	53	14	design	design	NOUN
asir-55444	53	15	can	can	AUX
asir-55444	53	16	meet	meet	VERB
asir-55444	53	17	the	the	DET
asir-55444	53	18	arc	arc	NOUN
asir-55444	53	19	height	height	NOUN
asir-55444	53	20	requirements	requirement	NOUN
asir-55444	53	21	of	of	ADP
asir-55444	53	22	the	the	DET
asir-55444	53	23	welding	welding	NOUN
asir-55444	53	24	wire	wire	NOUN
asir-55444	53	25	.	.	PUNCT
asir-55444	54	1	table	table	NOUN
asir-55444	54	2	1	1	NUM
asir-55444	54	3	.	.	PUNCT
asir-55444	54	4	discrete	discrete	ADJ
asir-55444	54	5	device	device	NOUN
asir-55444	54	6	package	package	NOUN
asir-55444	54	7	altimeter	altimeter	NOUN
asir-55444	54	8	encapsulated	encapsulate	VERB
asir-55444	54	9	type	type	NOUN
asir-55444	54	10	packaging	packaging	NOUN
asir-55444	54	11	height	height	NOUN
asir-55444	54	12	(	(	PUNCT
asir-55444	54	13	um	um	INTJ
asir-55444	54	14	)	)	PUNCT
asir-55444	54	15	base	base	NOUN
asir-55444	54	16	island	island	NOUN
asir-55444	54	17	frame	frame	NOUN
asir-55444	54	18	thickness	thickness	NOUN
asir-55444	54	19	(	(	PUNCT
asir-55444	54	20	um	um	INTJ
asir-55444	54	21	)	)	PUNCT
asir-55444	54	22	aluminum	aluminum	NOUN
asir-55444	54	23	wire	wire	NOUN
asir-55444	54	24	/	/	SYM
asir-55444	54	25	strip	strip	NOUN
asir-55444	54	26	thickness	thickness	NOUN
asir-55444	54	27	(	(	PUNCT
asir-55444	54	28	um	um	INTJ
asir-55444	54	29	)	)	PUNCT
asir-55444	54	30	remaining	remain	VERB
asir-55444	54	31	height	height	NOUN
asir-55444	54	32	(	(	PUNCT
asir-55444	54	33	um	um	INTJ
asir-55444	54	34	)	)	PUNCT
asir-55444	54	35	to-247	to-247	PROPN
asir-55444	54	36	5000	5000	NUM
asir-55444	54	37	1980	1980	NUM
asir-55444	54	38	250	250	NUM
asir-55444	54	39	2770	2770	NUM
asir-55444	54	40	to-220	to-220	PROPN
asir-55444	54	41	-	-	PUNCT
asir-55444	54	42	3l	3l	NUM
asir-55444	54	43	-	-	PUNCT
asir-55444	54	44	c	c	NOUN
asir-55444	54	45	4500	4500	NUM
asir-55444	54	46	1300	1300	NUM
asir-55444	54	47	250	250	NUM
asir-55444	54	48	2950	2950	NUM
asir-55444	54	49	to-252	to-252	NOUN
asir-55444	54	50	-	-	PUNCT
asir-55444	54	51	4r	4r	NUM
asir-55444	54	52	2300	2300	NUM
asir-55444	54	53	500	500	NUM
asir-55444	54	54	250	250	NUM
asir-55444	54	55	1550	1550	NUM
asir-55444	54	56	4.2	4.2	NUM
asir-55444	54	57	aluminum	aluminum	NOUN
asir-55444	54	58	wire	wire	NOUN
asir-55444	54	59	/	/	SYM
asir-55444	54	60	strip	strip	NOUN
asir-55444	54	61	mouth	mouth	NOUN
asir-55444	54	62	wedge	wedge	NOUN
asir-55444	54	63	end	end	VERB
asir-55444	54	64	face	face	NOUN
asir-55444	54	65	design	design	NOUN
asir-55444	54	66	improvement	improvement	NOUN
asir-55444	54	67	the	the	DET
asir-55444	54	68	end	end	NOUN
asir-55444	54	69	face	face	NOUN
asir-55444	54	70	of	of	ADP
asir-55444	54	71	the	the	DET
asir-55444	54	72	aluminum	aluminum	PROPN
asir-55444	54	73	wire	wire	NOUN
asir-55444	54	74	/	/	SYM
asir-55444	54	75	strip	strip	NOUN
asir-55444	54	76	mouth	mouth	NOUN
asir-55444	54	77	wedge	wedge	NOUN
asir-55444	54	78	is	be	AUX
asir-55444	54	79	designed	design	VERB
asir-55444	54	80	to	to	PART
asir-55444	54	81	be	be	AUX
asir-55444	54	82	v	v	ADV
asir-55444	54	83	-	-	PUNCT
asir-55444	54	84	shaped	shape	VERB
asir-55444	54	85	and	and	CCONJ
asir-55444	54	86	the	the	DET
asir-55444	54	87	bottom	bottom	NOUN
asir-55444	54	88	is	be	AUX
asir-55444	54	89	not	not	PART
asir-55444	54	90	flat	flat	ADJ
asir-55444	54	91	.	.	PUNCT
asir-55444	55	1	as	as	SCONJ
asir-55444	55	2	shown	show	VERB
asir-55444	55	3	in	in	ADP
asir-55444	55	4	figure	figure	NOUN
asir-55444	55	5	3	3	NUM
asir-55444	55	6	,	,	PUNCT
asir-55444	55	7	the	the	DET
asir-55444	55	8	upper	upper	ADJ
asir-55444	55	9	surface	surface	NOUN
asir-55444	55	10	of	of	ADP
asir-55444	55	11	the	the	DET
asir-55444	55	12	welding	welding	NOUN
asir-55444	55	13	point	point	NOUN
asir-55444	55	14	after	after	ADP
asir-55444	55	15	the	the	DET
asir-55444	55	16	completion	completion	NOUN
asir-55444	55	17	of	of	ADP
asir-55444	55	18	the	the	DET
asir-55444	55	19	welding	welding	NOUN
asir-55444	55	20	line	line	NOUN
asir-55444	55	21	is	be	AUX
asir-55444	55	22	a	a	DET
asir-55444	55	23	narrow	narrow	ADJ
asir-55444	55	24	rectangular	rectangular	ADJ
asir-55444	55	25	shape	shape	NOUN
asir-55444	55	26	.	.	PUNCT
asir-55444	56	1	convex	convex	PROPN
asir-55444	56	2	.	.	PUNCT
asir-55444	57	1	it	it	PRON
asir-55444	57	2	can	can	AUX
asir-55444	57	3	not	not	PART
asir-55444	57	4	be	be	AUX
asir-55444	57	5	reused	reuse	VERB
asir-55444	57	6	such	such	ADJ
asir-55444	57	7	as	as	ADP
asir-55444	57	8	dispensing	dispensing	NOUN
asir-55444	57	9	or	or	CCONJ
asir-55444	57	10	welding	welding	NOUN
asir-55444	57	11	.	.	PUNCT
asir-55444	58	1	without	without	ADP
asir-55444	58	2	changing	change	VERB
asir-55444	58	3	the	the	DET
asir-55444	58	4	interface	interface	NOUN
asir-55444	58	5	space	space	NOUN
asir-55444	58	6	of	of	ADP
asir-55444	58	7	the	the	DET
asir-55444	58	8	wedge	wedge	NOUN
asir-55444	58	9	side	side	NOUN
asir-55444	58	10	.	.	PUNCT
asir-55444	59	1	the	the	DET
asir-55444	59	2	v	v	ADV
asir-55444	59	3	-	-	PUNCT
asir-55444	59	4	shaped	shape	VERB
asir-55444	59	5	end	end	NOUN
asir-55444	59	6	face	face	NOUN
asir-55444	59	7	of	of	ADP
asir-55444	59	8	the	the	DET
asir-55444	59	9	aluminum	aluminum	NOUN
asir-55444	59	10	wire	wire	NOUN
asir-55444	59	11	steel	steel	NOUN
asir-55444	59	12	nozzle	nozzle	NOUN
asir-55444	59	13	wedge	wedge	NOUN
asir-55444	59	14	is	be	AUX
asir-55444	59	15	changed	change	VERB
asir-55444	59	16	to	to	ADP
asir-55444	59	17	a	a	DET
asir-55444	59	18	trapezoid	trapezoid	NOUN
asir-55444	59	19	.	.	PUNCT
asir-55444	60	1	at	at	ADP
asir-55444	60	2	the	the	DET
asir-55444	60	3	same	same	ADJ
asir-55444	60	4	time	time	NOUN
asir-55444	60	5	,	,	PUNCT
asir-55444	60	6	the	the	DET
asir-55444	60	7	height	height	NOUN
asir-55444	60	8	of	of	ADP
asir-55444	60	9	the	the	DET
asir-55444	60	10	trapezoid	trapezoid	NOUN
asir-55444	60	11	is	be	AUX
asir-55444	60	12	reduced	reduce	VERB
asir-55444	60	13	and	and	CCONJ
asir-55444	60	14	the	the	DET
asir-55444	60	15	width	width	NOUN
asir-55444	60	16	of	of	ADP
asir-55444	60	17	the	the	DET
asir-55444	60	18	upper	upper	ADJ
asir-55444	60	19	edge	edge	NOUN
asir-55444	60	20	of	of	ADP
asir-55444	60	21	the	the	DET
asir-55444	60	22	trapezoid	trapezoid	NOUN
asir-55444	60	23	is	be	AUX
asir-55444	60	24	increased	increase	VERB
asir-55444	60	25	.	.	PUNCT
asir-55444	61	1	the	the	DET
asir-55444	61	2	shape	shape	NOUN
asir-55444	61	3	of	of	ADP
asir-55444	61	4	the	the	DET
asir-55444	61	5	welding	welding	NOUN
asir-55444	61	6	line	line	NOUN
asir-55444	61	7	can	can	AUX
asir-55444	61	8	be	be	AUX
asir-55444	61	9	optimized	optimize	VERB
asir-55444	61	10	.	.	PUNCT
asir-55444	62	1	finally	finally	ADV
asir-55444	62	2	,	,	PUNCT
asir-55444	62	3	a	a	DET
asir-55444	62	4	platform	platform	NOUN
asir-55444	62	5	of	of	ADP
asir-55444	62	6	standard	standard	ADJ
asir-55444	62	7	rules	rule	NOUN
asir-55444	62	8	is	be	AUX
asir-55444	62	9	created	create	VERB
asir-55444	62	10	above	above	ADP
asir-55444	62	11	the	the	DET
asir-55444	62	12	welding	welding	NOUN
asir-55444	62	13	point	point	NOUN
asir-55444	62	14	.	.	PUNCT
asir-55444	63	1	it	it	PRON
asir-55444	63	2	can	can	AUX
asir-55444	63	3	be	be	AUX
asir-55444	63	4	used	use	VERB
asir-55444	63	5	for	for	ADP
asir-55444	63	6	secondary	secondary	ADJ
asir-55444	63	7	use	use	NOUN
asir-55444	63	8	such	such	ADJ
asir-55444	63	9	as	as	ADP
asir-55444	63	10	dispensing	dispense	VERB
asir-55444	63	11	or	or	CCONJ
asir-55444	63	12	welding	welding	NOUN
asir-55444	63	13	as	as	SCONJ
asir-55444	63	14	shown	show	VERB
asir-55444	63	15	in	in	ADP
asir-55444	63	16	figure	figure	NOUN
asir-55444	63	17	4	4	NUM
asir-55444	63	18	.	.	PUNCT
asir-55444	64	1	the	the	DET
asir-55444	64	2	thrust	thrust	NOUN
asir-55444	64	3	test	test	NOUN
asir-55444	64	4	strength	strength	NOUN
asir-55444	64	5	of	of	ADP
asir-55444	64	6	the	the	DET
asir-55444	64	7	pin	pin	NOUN
asir-55444	64	8	solder	solder	NOUN
asir-55444	64	9	joint	joint	NOUN
asir-55444	64	10	of	of	ADP
asir-55444	64	11	the	the	DET
asir-55444	64	12	re	re	ADJ
asir-55444	64	13	-	-	ADJ
asir-55444	64	14	designed	design	VERB
asir-55444	64	15	product	product	NOUN
asir-55444	64	16	meets	meet	VERB
asir-55444	64	17	the	the	DET
asir-55444	64	18	standard	standard	ADJ
asir-55444	64	19	requirements	requirement	NOUN
asir-55444	64	20	.	.	PUNCT
asir-55444	65	1	the	the	DET
asir-55444	65	2	solder	solder	NOUN
asir-55444	65	3	joint	joint	ADJ
asir-55444	65	4	area	area	NOUN
asir-55444	65	5	on	on	ADP
asir-55444	65	6	the	the	DET
asir-55444	65	7	surface	surface	NOUN
asir-55444	65	8	of	of	ADP
asir-55444	65	9	the	the	DET
asir-55444	65	10	chip	chip	NOUN
asir-55444	65	11	was	be	AUX
asir-55444	65	12	rotten	rotten	ADJ
asir-55444	65	13	ball	ball	NOUN
asir-55444	65	14	test	test	NOUN
asir-55444	65	15	without	without	ADP
asir-55444	65	16	crater	crater	NOUN
asir-55444	65	17	and	and	CCONJ
asir-55444	65	18	pressure	pressure	NOUN
asir-55444	65	19	zone	zone	NOUN
asir-55444	65	20	damage	damage	NOUN
asir-55444	65	21	.	.	PUNCT
asir-55444	66	1	www.scholink.org/ojs/index.php/asir	www.scholink.org/ojs/index.php/asir	PROPN
asir-55444	66	2	applied	apply	VERB
asir-55444	66	3	science	science	NOUN
asir-55444	66	4	and	and	CCONJ
asir-55444	66	5	innovative	innovative	ADJ
asir-55444	66	6	research	research	NOUN
asir-55444	66	7	vol	vol	NOUN
asir-55444	66	8	.	.	PROPN
asir-55444	67	1	8	8	NUM
asir-55444	67	2	,	,	PUNCT
asir-55444	67	3	no	no	INTJ
asir-55444	67	4	.	.	NOUN
asir-55444	67	5	4	4	NUM
asir-55444	67	6	,	,	PUNCT
asir-55444	67	7	2024	2024	NUM
asir-55444	67	8	193	193	NUM
asir-55444	67	9	published	publish	VERB
asir-55444	67	10	by	by	ADP
asir-55444	67	11	scholink	scholink	PROPN
asir-55444	67	12	inc	inc	PROPN
asir-55444	67	13	.	.	PROPN
asir-55444	67	14	figure	figure	NOUN
asir-55444	67	15	3	3	NUM
asir-55444	67	16	.	.	PUNCT
asir-55444	67	17	aluminum	aluminum	PROPN
asir-55444	67	18	wire	wire	NOUN
asir-55444	67	19	wedge	wedge	NOUN
asir-55444	67	20	tool	tool	NOUN
asir-55444	67	21	with	with	ADP
asir-55444	67	22	v	v	ADV
asir-55444	67	23	-	-	PUNCT
asir-55444	67	24	shaped	shape	VERB
asir-55444	67	25	end	end	NOUN
asir-55444	67	26	face	face	NOUN
asir-55444	67	27	figure	figure	NOUN
asir-55444	67	28	4	4	NUM
asir-55444	67	29	.	.	PUNCT
asir-55444	67	30	aluminum	aluminum	PROPN
asir-55444	67	31	wire	wire	NOUN
asir-55444	67	32	wedge	wedge	NOUN
asir-55444	67	33	tool	tool	NOUN
asir-55444	67	34	with	with	ADP
asir-55444	67	35	trapezoidal	trapezoidal	ADJ
asir-55444	67	36	end	end	NOUN
asir-55444	67	37	face	face	VERB
asir-55444	67	38	4.3	4.3	NUM
asir-55444	67	39	process	process	NOUN
asir-55444	67	40	optimization	optimization	NOUN
asir-55444	67	41	design	design	VERB
asir-55444	67	42	the	the	DET
asir-55444	67	43	u1	u1	NOUN
asir-55444	67	44	chip	chip	NOUN
asir-55444	67	45	is	be	AUX
asir-55444	67	46	still	still	ADV
asir-55444	67	47	bonded	bond	VERB
asir-55444	67	48	by	by	ADP
asir-55444	67	49	the	the	DET
asir-55444	67	50	lead	lead	ADJ
asir-55444	67	51	-	-	PUNCT
asir-55444	67	52	tin	tin	NOUN
asir-55444	67	53	wire	wire	NOUN
asir-55444	67	54	process	process	NOUN
asir-55444	67	55	.	.	PUNCT
asir-55444	68	1	the	the	DET
asir-55444	68	2	chip	chip	NOUN
asir-55444	68	3	volume	volume	NOUN
asir-55444	68	4	only	only	ADV
asir-55444	68	5	needs	need	VERB
asir-55444	68	6	to	to	PART
asir-55444	68	7	consider	consider	VERB
asir-55444	68	8	that	that	SCONJ
asir-55444	68	9	the	the	DET
asir-55444	68	10	distance	distance	NOUN
asir-55444	68	11	between	between	ADP
asir-55444	68	12	the	the	DET
asir-55444	68	13	chip	chip	NOUN
asir-55444	68	14	and	and	CCONJ
asir-55444	68	15	the	the	DET
asir-55444	68	16	edge	edge	NOUN
asir-55444	68	17	of	of	ADP
asir-55444	68	18	the	the	DET
asir-55444	68	19	frame	frame	NOUN
asir-55444	68	20	base	base	NOUN
asir-55444	68	21	island	island	NOUN
asir-55444	68	22	needs	need	VERB
asir-55444	68	23	to	to	PART
asir-55444	68	24	be	be	AUX
asir-55444	68	25	set	set	VERB
asir-55444	68	26	aside	aside	ADV
asir-55444	68	27	more	more	ADJ
asir-55444	68	28	than	than	ADP
asir-55444	68	29	0.5	0.5	NUM
asir-55444	68	30	mm	mm	NOUN
asir-55444	68	31	,	,	PUNCT
asir-55444	68	32	and	and	CCONJ
asir-55444	68	33	the	the	DET
asir-55444	68	34	packaging	packaging	NOUN
asir-55444	68	35	ratio	ratio	NOUN
asir-55444	68	36	is	be	AUX
asir-55444	68	37	greatly	greatly	ADV
asir-55444	68	38	optimized	optimize	VERB
asir-55444	68	39	.	.	PUNCT
asir-55444	69	1	after	after	SCONJ
asir-55444	69	2	the	the	DET
asir-55444	69	3	u1	u1	NOUN
asir-55444	69	4	chip	chip	NOUN
asir-55444	69	5	is	be	AUX
asir-55444	69	6	bonded	bond	VERB
asir-55444	69	7	,	,	PUNCT
asir-55444	69	8	the	the	DET
asir-55444	69	9	aluminum	aluminum	NOUN
asir-55444	69	10	wire	wire	NOUN
asir-55444	69	11	bonding	bonding	NOUN
asir-55444	69	12	is	be	AUX
asir-55444	69	13	carried	carry	VERB
asir-55444	69	14	out	out	ADP
asir-55444	69	15	,	,	PUNCT
asir-55444	69	16	and	and	CCONJ
asir-55444	69	17	the	the	DET
asir-55444	69	18	position	position	NOUN
asir-55444	69	19	of	of	ADP
asir-55444	69	20	the	the	DET
asir-55444	69	21	aluminum	aluminum	NOUN
asir-55444	69	22	wire	wire	NOUN
asir-55444	69	23	solder	solder	NOUN
asir-55444	69	24	joint	joint	NOUN
asir-55444	69	25	on	on	ADP
asir-55444	69	26	the	the	DET
asir-55444	69	27	chip	chip	NOUN
asir-55444	69	28	surface	surface	NOUN
asir-55444	69	29	is	be	AUX
asir-55444	69	30	optimized	optimize	VERB
asir-55444	69	31	.	.	PUNCT
asir-55444	70	1	the	the	DET
asir-55444	70	2	distance	distance	NOUN
asir-55444	70	3	between	between	ADP
asir-55444	70	4	the	the	DET
asir-55444	70	5	solder	solder	NOUN
asir-55444	70	6	joints	joint	NOUN
asir-55444	70	7	can	can	AUX
asir-55444	70	8	be	be	AUX
asir-55444	70	9	adjusted	adjust	VERB
asir-55444	70	10	according	accord	VERB
asir-55444	70	11	to	to	ADP
asir-55444	70	12	the	the	DET
asir-55444	70	13	size	size	NOUN
asir-55444	70	14	of	of	ADP
asir-55444	70	15	the	the	DET
asir-55444	70	16	u2	u2	PROPN
asir-55444	70	17	chip	chip	NOUN
asir-55444	70	18	to	to	PART
asir-55444	70	19	complete	complete	VERB
asir-55444	70	20	the	the	DET
asir-55444	70	21	adhesion	adhesion	NOUN
asir-55444	70	22	of	of	ADP
asir-55444	70	23	the	the	DET
asir-55444	70	24	u2	u2	NOUN
asir-55444	70	25	chip	chip	NOUN
asir-55444	70	26	.	.	PUNCT
asir-55444	71	1	according	accord	VERB
asir-55444	71	2	to	to	ADP
asir-55444	71	3	the	the	DET
asir-55444	71	4	glue	glue	NOUN
asir-55444	71	5	type	type	NOUN
asir-55444	71	6	,	,	PUNCT
asir-55444	71	7	the	the	DET
asir-55444	71	8	baking	baking	NOUN
asir-55444	71	9	is	be	AUX
asir-55444	71	10	completed	complete	VERB
asir-55444	71	11	in	in	ADP
asir-55444	71	12	the	the	DET
asir-55444	71	13	oven	oven	NOUN
asir-55444	71	14	,	,	PUNCT
asir-55444	71	15	and	and	CCONJ
asir-55444	71	16	the	the	DET
asir-55444	71	17	ball	ball	NOUN
asir-55444	71	18	welding	welding	NOUN
asir-55444	71	19	of	of	ADP
asir-55444	71	20	the	the	DET
asir-55444	71	21	gold	gold	ADJ
asir-55444	71	22	wire	wire	NOUN
asir-55444	71	23	or	or	CCONJ
asir-55444	71	24	copper	copper	NOUN
asir-55444	71	25	wire	wire	NOUN
asir-55444	71	26	is	be	AUX
asir-55444	71	27	finally	finally	ADV
asir-55444	71	28	completed	complete	VERB
asir-55444	71	29	.	.	PUNCT
asir-55444	72	1	the	the	DET
asir-55444	72	2	profile	profile	ADJ
asir-55444	72	3	diagram	diagram	NOUN
asir-55444	72	4	is	be	AUX
asir-55444	72	5	shown	show	VERB
asir-55444	72	6	in	in	ADP
asir-55444	72	7	figure	figure	NOUN
asir-55444	72	8	5	5	NUM
asir-55444	72	9	.	.	PUNCT
asir-55444	73	1	the	the	DET
asir-55444	73	2	appearance	appearance	NOUN
asir-55444	73	3	and	and	CCONJ
asir-55444	73	4	electron	electron	NOUN
asir-55444	73	5	microscope	microscope	NOUN
asir-55444	73	6	diagram	diagram	NOUN
asir-55444	73	7	of	of	ADP
asir-55444	73	8	the	the	DET
asir-55444	73	9	finished	finished	ADJ
asir-55444	73	10	product	product	NOUN
asir-55444	73	11	after	after	SCONJ
asir-55444	73	12	packaging	packaging	NOUN
asir-55444	73	13	are	be	AUX
asir-55444	73	14	shown	show	VERB
asir-55444	73	15	in	in	ADP
asir-55444	73	16	figure	figure	NOUN
asir-55444	73	17	6	6	NUM
asir-55444	73	18	and	and	CCONJ
asir-55444	73	19	figure	figure	VERB
asir-55444	73	20	7	7	NUM
asir-55444	73	21	.	.	NOUN
asir-55444	73	22	www.scholink.org/ojs/index.php/asir	www.scholink.org/ojs/index.php/asir	NOUN
asir-55444	73	23	applied	apply	VERB
asir-55444	73	24	science	science	NOUN
asir-55444	73	25	and	and	CCONJ
asir-55444	73	26	innovative	innovative	ADJ
asir-55444	73	27	research	research	NOUN
asir-55444	73	28	vol	vol	NOUN
asir-55444	73	29	.	.	PROPN
asir-55444	74	1	8	8	NUM
asir-55444	74	2	,	,	PUNCT
asir-55444	74	3	no	no	INTJ
asir-55444	74	4	.	.	NOUN
asir-55444	74	5	4	4	NUM
asir-55444	74	6	,	,	PUNCT
asir-55444	74	7	2024	2024	NUM
asir-55444	74	8	194	194	NUM
asir-55444	74	9	published	publish	VERB
asir-55444	74	10	by	by	ADP
asir-55444	74	11	scholink	scholink	PROPN
asir-55444	74	12	inc	inc	PROPN
asir-55444	74	13	.	.	PROPN
asir-55444	74	14	figure	figure	NOUN
asir-55444	74	15	5	5	NUM
asir-55444	74	16	.	.	PUNCT
asir-55444	74	17	plastic	plastic	NOUN
asir-55444	74	18	sealing	sealing	NOUN
asir-55444	74	19	body	body	NOUN
asir-55444	74	20	section	section	NOUN
asir-55444	74	21	diagram	diagram	NOUN
asir-55444	74	22	figure	figure	NOUN
asir-55444	74	23	6	6	NUM
asir-55444	74	24	.	.	PUNCT
asir-55444	74	25	secondary	secondary	ADJ
asir-55444	74	26	mounting	mount	VERB
asir-55444	74	27	product	product	NOUN
asir-55444	74	28	appearance	appearance	NOUN
asir-55444	74	29	diagram	diagram	NOUN
asir-55444	74	30	figure	figure	NOUN
asir-55444	74	31	7	7	NUM
asir-55444	74	32	.	.	PUNCT
asir-55444	74	33	electron	electron	PROPN
asir-55444	74	34	microscope	microscope	PROPN
asir-55444	74	35	diagram	diagram	NOUN
asir-55444	74	36	of	of	ADP
asir-55444	74	37	secondary	secondary	ADJ
asir-55444	74	38	mounting	mount	VERB
asir-55444	74	39	products	product	NOUN
asir-55444	74	40	www.scholink.org/ojs/index.php/asir	www.scholink.org/ojs/index.php/asir	NOUN
asir-55444	74	41	applied	apply	VERB
asir-55444	74	42	science	science	NOUN
asir-55444	74	43	and	and	CCONJ
asir-55444	74	44	innovative	innovative	ADJ
asir-55444	74	45	research	research	NOUN
asir-55444	74	46	vol	vol	NOUN
asir-55444	74	47	.	.	PROPN
asir-55444	75	1	8	8	NUM
asir-55444	75	2	,	,	PUNCT
asir-55444	75	3	no	no	INTJ
asir-55444	75	4	.	.	NOUN
asir-55444	75	5	4	4	NUM
asir-55444	75	6	,	,	PUNCT
asir-55444	75	7	2024	2024	NUM
asir-55444	75	8	195	195	NUM
asir-55444	75	9	published	publish	VERB
asir-55444	75	10	by	by	ADP
asir-55444	75	11	scholink	scholink	PROPN
asir-55444	75	12	inc	inc	PROPN
asir-55444	75	13	.	.	PROPN
asir-55444	75	14	5	5	NUM
asir-55444	75	15	.	.	NOUN
asir-55444	75	16	batch	batch	NOUN
asir-55444	75	17	production	production	NOUN
asir-55444	75	18	results	result	NOUN
asir-55444	75	19	after	after	ADP
asir-55444	75	20	the	the	DET
asir-55444	75	21	re	re	NOUN
asir-55444	75	22	-	-	NOUN
asir-55444	75	23	optimization	optimization	ADJ
asir-55444	75	24	design	design	NOUN
asir-55444	75	25	of	of	ADP
asir-55444	75	26	the	the	DET
asir-55444	75	27	packaging	packaging	NOUN
asir-55444	75	28	structure	structure	NOUN
asir-55444	75	29	and	and	CCONJ
asir-55444	75	30	process	process	NOUN
asir-55444	75	31	flow	flow	NOUN
asir-55444	75	32	,	,	PUNCT
asir-55444	75	33	the	the	DET
asir-55444	75	34	problem	problem	NOUN
asir-55444	75	35	of	of	ADP
asir-55444	75	36	limited	limited	ADJ
asir-55444	75	37	size	size	NOUN
asir-55444	75	38	of	of	ADP
asir-55444	75	39	the	the	DET
asir-55444	75	40	u1	u1	NOUN
asir-55444	75	41	chip	chip	NOUN
asir-55444	75	42	of	of	ADP
asir-55444	75	43	the	the	DET
asir-55444	75	44	discrete	discrete	ADJ
asir-55444	75	45	device	device	NOUN
asir-55444	75	46	mcp	mcp	PROPN
asir-55444	75	47	package	package	NOUN
asir-55444	75	48	is	be	AUX
asir-55444	75	49	solved	solve	VERB
asir-55444	75	50	,	,	PUNCT
asir-55444	75	51	and	and	CCONJ
asir-55444	75	52	the	the	DET
asir-55444	75	53	problems	problem	NOUN
asir-55444	75	54	of	of	ADP
asir-55444	75	55	lead	lead	NOUN
asir-55444	75	56	-	-	PUNCT
asir-55444	75	57	tin	tin	NOUN
asir-55444	75	58	overflow	overflow	NOUN
asir-55444	75	59	at	at	ADP
asir-55444	75	60	the	the	DET
asir-55444	75	61	edge	edge	NOUN
asir-55444	75	62	of	of	ADP
asir-55444	75	63	the	the	DET
asir-55444	75	64	lead	lead	ADJ
asir-55444	75	65	frame	frame	NOUN
asir-55444	75	66	base	base	NOUN
asir-55444	75	67	island	island	NOUN
asir-55444	75	68	,	,	PUNCT
asir-55444	75	69	less	less	ADJ
asir-55444	75	70	tin	tin	NOUN
asir-55444	75	71	under	under	ADP
asir-55444	75	72	the	the	DET
asir-55444	75	73	chip	chip	NOUN
asir-55444	75	74	,	,	PUNCT
asir-55444	75	75	and	and	CCONJ
asir-55444	75	76	chip	chip	NOUN
asir-55444	75	77	edge	edge	NOUN
asir-55444	75	78	damage	damage	NOUN
asir-55444	75	79	(	(	PUNCT
asir-55444	75	80	bonding	bond	VERB
asir-55444	75	81	jaw	jaw	NOUN
asir-55444	75	82	crush	crush	NOUN
asir-55444	75	83	)	)	PUNCT
asir-55444	75	84	are	be	AUX
asir-55444	75	85	greatly	greatly	ADV
asir-55444	75	86	reduced	reduce	VERB
asir-55444	75	87	.	.	PUNCT
asir-55444	76	1	at	at	ADP
asir-55444	76	2	the	the	DET
asir-55444	76	3	same	same	ADJ
asir-55444	76	4	time	time	NOUN
asir-55444	76	5	,	,	PUNCT
asir-55444	76	6	the	the	DET
asir-55444	76	7	electrical	electrical	ADJ
asir-55444	76	8	output	output	NOUN
asir-55444	76	9	of	of	ADP
asir-55444	76	10	the	the	DET
asir-55444	76	11	product	product	NOUN
asir-55444	76	12	is	be	AUX
asir-55444	76	13	guaranteed	guarantee	VERB
asir-55444	76	14	.	.	PUNCT
asir-55444	77	1	after	after	ADP
asir-55444	77	2	20,000	20,000	NUM
asir-55444	77	3	productions	production	NOUN
asir-55444	77	4	,	,	PUNCT
asir-55444	77	5	the	the	DET
asir-55444	77	6	product	product	NOUN
asir-55444	77	7	packaging	packaging	NOUN
asir-55444	77	8	yield	yield	NOUN
asir-55444	77	9	is	be	AUX
asir-55444	77	10	as	as	ADV
asir-55444	77	11	high	high	ADJ
asir-55444	77	12	as	as	ADP
asir-55444	77	13	98	98	NUM
asir-55444	77	14	%	%	NOUN
asir-55444	77	15	,	,	PUNCT
asir-55444	77	16	and	and	CCONJ
asir-55444	77	17	the	the	DET
asir-55444	77	18	product	product	NOUN
asir-55444	77	19	yield	yield	NOUN
asir-55444	77	20	is	be	AUX
asir-55444	77	21	increased	increase	VERB
asir-55444	77	22	to	to	ADP
asir-55444	77	23	more	more	ADJ
asir-55444	77	24	than	than	ADP
asir-55444	77	25	97	97	NUM
asir-55444	77	26	%	%	NOUN
asir-55444	77	27	after	after	ADP
asir-55444	77	28	product	product	NOUN
asir-55444	77	29	testing	testing	NOUN
asir-55444	77	30	.	.	PUNCT
asir-55444	78	1	no	no	DET
asir-55444	78	2	fluctuations	fluctuation	NOUN
asir-55444	78	3	in	in	ADP
asir-55444	78	4	packaging	packaging	NOUN
asir-55444	78	5	yield	yield	NOUN
asir-55444	78	6	and	and	CCONJ
asir-55444	78	7	test	test	NOUN
asir-55444	78	8	yield	yield	NOUN
asir-55444	78	9	were	be	AUX
asir-55444	78	10	found	find	VERB
asir-55444	78	11	among	among	ADP
asir-55444	78	12	multiple	multiple	ADJ
asir-55444	78	13	batches	batch	NOUN
asir-55444	78	14	,	,	PUNCT
asir-55444	78	15	and	and	CCONJ
asir-55444	78	16	it	it	PRON
asir-55444	78	17	was	be	AUX
asir-55444	78	18	believed	believe	VERB
asir-55444	78	19	that	that	SCONJ
asir-55444	78	20	the	the	DET
asir-55444	78	21	packaging	packaging	NOUN
asir-55444	78	22	structure	structure	NOUN
asir-55444	78	23	and	and	CCONJ
asir-55444	78	24	process	process	NOUN
asir-55444	78	25	design	design	NOUN
asir-55444	78	26	were	be	AUX
asir-55444	78	27	optimized	optimize	VERB
asir-55444	78	28	.	.	PUNCT
asir-55444	79	1	6	6	X
asir-55444	79	2	.	.	X
asir-55444	79	3	conclusion	conclusion	NOUN
asir-55444	79	4	the	the	DET
asir-55444	79	5	results	result	NOUN
asir-55444	79	6	of	of	ADP
asir-55444	79	7	mcp	mcp	PROPN
asir-55444	79	8	packaging	packaging	NOUN
asir-55444	79	9	structure	structure	NOUN
asir-55444	79	10	and	and	CCONJ
asir-55444	79	11	process	process	NOUN
asir-55444	79	12	optimization	optimization	NOUN
asir-55444	79	13	of	of	ADP
asir-55444	79	14	semiconductor	semiconductor	NOUN
asir-55444	79	15	discrete	discrete	NOUN
asir-55444	79	16	devices	device	NOUN
asir-55444	79	17	show	show	VERB
asir-55444	79	18	that	that	PRON
asir-55444	79	19	.	.	PUNCT
asir-55444	80	1	the	the	DET
asir-55444	80	2	problem	problem	NOUN
asir-55444	80	3	of	of	ADP
asir-55444	80	4	limited	limited	ADJ
asir-55444	80	5	packaging	packaging	NOUN
asir-55444	80	6	ratio	ratio	NOUN
asir-55444	80	7	of	of	ADP
asir-55444	80	8	discrete	discrete	ADJ
asir-55444	80	9	devices	device	NOUN
asir-55444	80	10	is	be	AUX
asir-55444	80	11	effectively	effectively	ADV
asir-55444	80	12	solved	solve	VERB
asir-55444	80	13	by	by	ADP
asir-55444	80	14	secondary	secondary	ADJ
asir-55444	80	15	bonding	bonding	NOUN
asir-55444	80	16	on	on	ADP
asir-55444	80	17	the	the	DET
asir-55444	80	18	surface	surface	NOUN
asir-55444	80	19	of	of	ADP
asir-55444	80	20	aluminum	aluminum	NOUN
asir-55444	80	21	wire	wire	NOUN
asir-55444	80	22	solder	solder	NOUN
asir-55444	80	23	joints	joint	NOUN
asir-55444	80	24	.	.	PUNCT
asir-55444	81	1	the	the	DET
asir-55444	81	2	process	process	NOUN
asir-55444	81	3	problems	problem	NOUN
asir-55444	81	4	such	such	ADJ
asir-55444	81	5	as	as	ADP
asir-55444	81	6	lead	lead	NOUN
asir-55444	81	7	-	-	PUNCT
asir-55444	81	8	tin	tin	NOUN
asir-55444	81	9	overflow	overflow	NOUN
asir-55444	81	10	at	at	ADP
asir-55444	81	11	the	the	DET
asir-55444	81	12	edge	edge	NOUN
asir-55444	81	13	of	of	ADP
asir-55444	81	14	the	the	DET
asir-55444	81	15	lead	lead	ADJ
asir-55444	81	16	frame	frame	NOUN
asir-55444	81	17	base	base	NOUN
asir-55444	81	18	island	island	NOUN
asir-55444	81	19	and	and	CCONJ
asir-55444	81	20	less	less	ADJ
asir-55444	81	21	chip	chip	NOUN
asir-55444	81	22	tin	tin	NOUN
asir-55444	81	23	are	be	AUX
asir-55444	81	24	eliminated	eliminate	VERB
asir-55444	81	25	.	.	PUNCT
asir-55444	82	1	references	reference	NOUN
asir-55444	82	2	longle	longle	VERB
asir-55444	82	3	.	.	PUNCT
asir-55444	83	1	(	(	PUNCT
asir-55444	83	2	2006	2006	NUM
asir-55444	83	3	)	)	PUNCT
asir-55444	83	4	.	.	PUNCT
asir-55444	84	1	multichip	multichip	NOUN
asir-55444	84	2	packaging	packaging	NOUN
asir-55444	84	3	technology	technology	NOUN
asir-55444	84	4	and	and	CCONJ
asir-55444	84	5	its	its	PRON
asir-55444	84	6	application	application	NOUN
asir-55444	84	7	.	.	PUNCT
asir-55444	85	1	electronics	electronic	NOUN
asir-55444	85	2	and	and	CCONJ
asir-55444	85	3	packaging	packaging	NOUN
asir-55444	85	4	,	,	PUNCT
asir-55444	85	5	6(1	6(1	NUM
asir-55444	85	6	)	)	PUNCT
asir-55444	85	7	,	,	PUNCT
asir-55444	85	8	12	12	NUM
asir-55444	85	9	-	-	SYM
asir-55444	85	10	15	15	NUM
asir-55444	85	11	.	.	PUNCT
asir-55444	86	1	zhang	zhang	PROPN
asir-55444	86	2	guangyuan	guangyuan	PROPN
asir-55444	86	3	.	.	PUNCT
asir-55444	87	1	(	(	PUNCT
asir-55444	87	2	2001	2001	NUM
asir-55444	87	3	)	)	PUNCT
asir-55444	87	4	.	.	PUNCT
asir-55444	88	1	prospects	prospect	NOUN
asir-55444	88	2	of	of	ADP
asir-55444	88	3	single	single	ADJ
asir-55444	88	4	chip	chip	NOUN
asir-55444	88	5	packaging	packaging	NOUN
asir-55444	88	6	and	and	CCONJ
asir-55444	88	7	multichip	multichip	NOUN
asir-55444	88	8	packaging	packaging	NOUN
asir-55444	88	9	.	.	PUNCT
asir-55444	89	1	electronics	electronic	NOUN
asir-55444	89	2	and	and	CCONJ
asir-55444	89	3	packaging	packaging	NOUN
asir-55444	89	4	,	,	PUNCT
asir-55444	89	5	1(1	1(1	NUM
asir-55444	89	6	)	)	PUNCT
asir-55444	89	7	,	,	PUNCT
asir-55444	89	8	11	11	NUM
asir-55444	89	9	-	-	SYM
asir-55444	89	10	15	15	NUM
asir-55444	89	11	.	.	PUNCT