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easat-10444	doi.org	https://doi.org/10.1080/01559982.2025.2451004
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easat-10444	doi.org	https://doi.org/10.3390/su151914165
easat-10444	doi.org	https://doi.org/10.1016/j.chbr.2024.100572
easat-10444	doi.org	https://doi.org/10.1016/j.procs.2025.05.163
easat-10444	doi.org	https://doi.org/10.1016/j.giq.2022.101685
easat-10444	doi.org	https://doi.org/10.1109/msec.2025.3550927
easat-10444	doi.org	https://doi.org/10.3390/app15105715
easat-10444	doi.org	https://doi.org/10.1136/bmj.n71
easat-10444	doi.org	https://doi.org/10.3390/su15097704
easat-10444	doi.org	https://doi.org/10.1007/s11142-024-09833-9
easat-10444	doi.org	https://doi.org/10.5267/j.ijdns.2023.9.014
easat-10444	doi.org	https://doi.org/10.3390/electronics11203291
easat-10444	doi.org	https://doi.org/10.1155/2022/8257880
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easat-10444	doi.org	https://doi.org/10.1057/s41599-024-02905-w
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easat-10444	doi.org	https://doi.org/10.2308/jeta-2022-026
easat-10444	doi.org	https://doi.org/10.1016/j.techfore.2024.123251
easat-10444	doi.org	https://doi.org/10.5267/j.ijdns.2023.9.014
easat-10444	doi.org	https://doi.org/10.3390/electronics11203291
easat-10444	doi.org	https://doi.org/10.1155/2022/8257880
easat-10444	doi.org	https://doi.org/10.1155/2022/3803566
easat-10444	doi.org	https://doi.org/10.1057/s41599-024-02905-w
easat-10444	doi.org	https://doi.org/10.3390/jrfm17070276
easat-10444	doi.org	https://doi.org/10.3390/jrfm17080372
easat-10444	doi.org	https://doi.org/10.13189/ujaf.2021.090302
easat-10444	doi.org	https://doi.org/10.2308/jeta-2022-026
easat-10444	doi.org	https://doi.org/10.1016/j.techfore.2024.123251