id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
fuelectenerg-1822	Ghaffarian, Reza	MICROELECTRONICS PACKAGING TECHNOLOGY ROADMAPS, ASSEMBLY RELIABILITY, AND PROGNOSTICS	2016	69	.pdf	application/pdf	26146	1282	46	The flip chip in package technology has been widely used in high performance FCIP applications for more than a decade. The integration of chip technologies, micro optical components and packaging for building up a real system in a package (SIP) (for optoelectronic application) needs developments in many areas in order to achieve higher image quality for the CCD sensors.	cache/fuelectenerg-1822.pdf	txt/fuelectenerg-1822.txt