id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
fumecheng-10949	Hwang, Byungil; Han, Yurim; Matteini, Paolo	BENDING FATIGUE BEHAVIOR OF AG NANOWIRE/CU THIN-FILM HYBRID INTERCONNECTS FOR WEARABLE ELECTRONICS	2022	8	.pdf	application/pdf	3529	194	61	Cu thin films were deposited on the Ag nanowire/PI samples via a magnetron sputtering system. Lastly, a Cu thin film was deposited on the PI substrate using DC magnetron sputtering at 100 W at room temperature for 15 min. Thickness of Cu thin film was ~400 nm.	cache/fumecheng-10949.pdf	txt/fumecheng-10949.txt