id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
fumecheng-14015	Choi, Sooyong; Chen, Chih-Ming; Hwang, Byungil	CU-CU MECHANICAL BONDING FOR 3D INTEGRATION OF THE NEXT GENERATION ELECTRONIC CHIPS: INTERFACIAL MECHANISMS, SURFACE ENGINEERING, AND EMERGING LOW-TEMPERATURE STRATEGIES	2025	23	.pdf	application/pdf	11938	573	53	Lee, S., Park, S., Kim, S.E., 2023, Low-temperature diffusion of Au and Ag nanolayers for Cu bonding, Applied Sciences, 14(1), 147. In SAB, an ion or high-velocity atomic beam is used to activate the bonding surfaces in a UHV environment, facilitating the formation of chemical bonds between Cu surfaces at room temperature [62].	cache/fumecheng-14015.pdf	txt/fumecheng-14015.txt