id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
fis-105	Vogel, K.; Wuensch, D.; Shaporin, A.; Mehner, J.; Billep, D.; Wiemer, M.	Crack propagation in micro-chevron-test samples of direct bonded silicon-silicon wafers	2013	8	.pdf	application/pdf	4566	227	64	To initiate ment, the spec ro-chevron-sam ll defined cra odulus E and ng YMIN in t the maximu e to be prepa re applying th e wafers in de o specimens, t e the force, tw cimen has to b mples. In addition t ried out in fu n to microsys T. Otto, In: T 307. C. Jia, D. Wu , T. Gessner, r wafer bondi Hiller, K. Ka ence and Eng MEMS and M. Petzold, El Int.	cache/fis-105.pdf	txt/fis-105.txt