id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
fis-2033	Hiyoshi, Noritake; Yamashita, Mitsuo; Hokazono, Hiroaki	Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders	2018	9	.pdf	application/pdf	4199	240	59	Crack propagation cycle was calculated as subtract the crack initiation cycle (Ni) from the total number of cycles (N). =0.3%  =0.4% Figure 7: Crack propagation curve of Sn-low-Ag-Cu solders at 313 K. Fig, 8 shows the number of crack propagation cycles which crack length reached to 5mm for comparing the crack propagation rate.	cache/fis-2033.pdf	txt/fis-2033.txt