id	author	title	date	pages	extension	mime	words	sentence	flesch	summary	cache	txt
fis-2941	Zhang, Dianhao; Huang, Xiao-guang; Cheng, Bin-liang; Zhang, Neng	Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module	2020	11	.pdf	application/pdf	4449	266	63	It can be seen that the predicted results from the Engelmaier model and creep strain energy density model are almost the same, and the thermal fatigue life from creep strain model is relatively shorter. Shear stress-strain of element E2 at TIM2 solder layer: (a) stress, (b) strain.	cache/fis-2941.pdf	txt/fis-2941.txt