Microsoft Word - Vol 6-2p5V2-press.doc


IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 47

MEMS ELECTROMAGNETIC MICRO RELAYS 
OVERVIEW AND DESIGN CONSIDERATIONS 

ZURAINI DAHARI, THURAI VINAY AND DINESH SOOD 
School of Electrical and Computer Engineering  

RMIT University, GPO Box  2476V, Melbourne, Australia  

s3047454@student.rmit.edu.au  
 

Abstract : Miniature electromagnetic relay matrices capable of switching currents up to 
one ampere range are  widely used in commercial applications such as instrumentation 
and telecommunication. Traditionally these devices have been fabricated from a number 
of discrete components, however in recent years the emergence of Micro Electro 
Mechanical System (MEMS) technology has opened up the possibility for batch 
fabrication of microrelays at much reduced unit cost. While several electromagnetic 
microrelay designs have been successfully developed and commercialized for use as 
individual units, development work on electromagnetic microrelay matrices where 
individual relays can be selectively switched on and off have been fewer and less 
successful. Due to inherent limitations of the micromachining processes, significant 
dimensional and material property variations occur among individual relays in a matrix. 
These variations severely limit the tolerance window and hence the reliability of 
operation of the device. After reviewing existing designs of electromagnetic microrelays, 
a set of desirable design features that would make the electromagnetic microrelay more 
robust are identified.  A novel design incorporating these features is proposed and 
preliminary results of ANSYS1 simulation studies are presented. 

Keywords: MEMS, microrelay and electromagnetic 

1. INTRODUCTION 

Recent trend in the world market shows a continuing demand for the miniaturization of 
devices. This trend has triggered the emergence of microelectromechanical systems 
(MEMS) technology in the past few decades. MEMS technologies such as silicon 
micromachining, bulk micromachining and LIGA (German Acronym for Lithographie, 
Galvano-formung, Abformung) offer significant advantages in size reduction without 
sacrificing device performance. Some of the motivating factors are reduced cost, weight 
and power consumption.  MEMS technology is multidisciplinary with its applications 
ranging from optics, transportation, aerospace, robotics, chemical analysis, and 
biotechnologies. Comprehensive details on MEMS technology could be referred to Madou 
[1], Senturia [2] and Pelesko [3]. MEMS pressure sensors, accelerometers are now 
established commercialized products [4]. Electromechanical microrelay is amongst the 
predicted MEMS-based products to be commercialized in the next five years [5]. 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 48

The commercial need for relays up to 2A is projected to be 1 billion units annually. 
Despite the rapid advances of the semiconductor, the electromechanical relays (EMR) still 
serves about ninety percent (90%) of the market needs compared to ten percent (10%) by 
solid state relays (SSR). The major reasons of the continuing use of electromechanical 
relays are due to its robustness and reliability in harsh environments. In addition, they 
have large switching range from µV and µA, could handle both DC and AC signals, have 
low contact resistance (mΩ) and high insulation resistance (MΩ) [6]. Figure 1 shows the 
miniaturization trend in manufacturing relays during the past 40 years. As can be seen 
from Fig. 1, the predicted board space for the next generation would be about 30 mm2, the 
volume about 100 mm2. Through MEMS technology, micro sized electromechanical relay, 
termed microrelay which integrates the merits of both SSR and EMR could be 
manufactured. MEMS technology offers possibility for exceptional miniaturization of 
relays, extremely low power consumption and high shock resistance.  

 

Fig. 1: Ongoing miniaturization of telecom relays during the past 40 years [6] 

Pioneered by Petersen [7], realization of microrelay using MEMS technologies has 
attracted interests of a number of researchers in both academic and industrial field. Relay 
operation requires sufficient contact force to provide stable contact, reliable opening 
which involves a lift-off force which exceeds the adherence of sticking contacts and the 
highest possible breakdown voltage to assure electrical insulation between the open 
contacts and driving circuit. The basic requirements for microrelay design can be derived 
as 300 µN contact force to achieve contact resistance less than 100 mΩ, lift-off force 
greater than 300 µN to overcome adherence, and contact gap in the range of 100 to 250 
µm to have a breakdown voltage greater than 500 V [8]. These key parameters are 
dependable on the contact material, actuation means and mechanical design. From a report 
by Schimkat [8], AuNi5 is reported as a well suited contact material for microrelays due to 
relatively high contact force and lower adhesion force. Table 1 summarized the 
experimental results of the characteristics of several contact materials.   

Various actuation methods have been demonstrated successfully; such as electrostatic 
[9,10,11], thermal [12, 13,14] and electromagnetic [15,16]. The most typical method is 
electrostatic due to its simplicity, small size and the versatility of integration with the 
standard integrated circuit (IC) technologies. However, the basic design requirements 
mentioned above are beyond the operating range of typical electrostatic microrelay. 
Recently, electromagnetic actuation has generated considerable interest. The feasibility of 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 49

magnetic materials in MEMS technologies are discussed thoroughly by Busch-Vishniac 
[17], G. Reyne [18] and D. Niarchos [19]. 

Table 1: Characteristics Contact Data for Microrelays [8]. 

 Au AuNi5 Rh 

Minimum contact force for stable contact, Fmin 
(mN) 

<0.1 0.3 0.6 

Maximum adherence force, Fad (mN) 2.7 0.3 < 0.1 

Contact resistance, Rc at Fmin (mΩ) <30 <100  <1000 

Though some improvement in magnetic materials properties and compatibility with IC 
processing still remains a challenge, electromagnetic actuation has been the preferred 
choice in microrelay applications where larger contact force (few millinewtons) is required 
to achieve stable electrical contact [20]. Besides, it is also possible to achieve latching by 
adding permanent magnet or semi-hard magnetic material thereby minimising power 
consumption [21]. In the case of microrelay matrices, where individual relays will have to 
be switched on and off selectively, reliability of operation remains an issue owing to the 
difficulty in achieving sufficient dimensional uniformity among individual relays in the 
matrix during their manufacture. Authors’ research is concerned with the development of a 
robust design for the microrelay that will be more tolerant to MEMS fabrication 
imperfections. A novel design of the electromagnetic microrelay  is proposed and analysed 
using ANSYS finite element analysis software. 

2. ELECTROMAGNETIC MICRORELAYS 

Traditionally electromagnetic relays have been fabricated from a number of discrete 
components which include an armature made of soft magnetic material, elastic spring, 
electromagnetic coil, a magnetic core, and special metal contacts [22]. For applications 
requiring the switch to remain open or closed for relatively long periods of time, a 
permanent magnet is incorporated into the magnetic circuit to maintain the switch in the 
closed position even when the control signal is removed. Implementation of magnetic 
actuation schemes at the micro scale is quite challenging. The most problematic is the 
design and fabrication of the excitation coil that would provide sufficient ampere-turns. 
Deposition of magnetic materials and their subsequent patterning and treatment to impart 
desirable characteristics to them are also difficult in a micro fabrication environment [19]. 
Micromachined electromagnetic relays reported in early publications [23-26] are simply 
adaptations of the conventional relay design to suit the microfabrication environment. 
Planar magnetic coil and flat cantilever spring element have been common features in all 
of them. 

2.1 Principle of operation of the electromagnetic microrelay 

Most magnetic microactuators that are reported in publications depend on the attractive 
force that can be generated between an armature made of ferromagnetic material and a 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 50

current-carrying coil [27], as shown in Fig. 2. Related to the above microactuators are 
devices that use a permanent magnet instead of the magnetisable armature as shown in 
Fig. 3. These devices have the advantage that the actuator can generate both attractive and 
repulsive forces. More importantly, the relay could be held in its closed state even after the 
control current is removed. 

  

Fig. 2: Magnetization-type actuator. Fig. 3: Planar magnetic microactuator. 

The operation of the latching electromagnetic microrelay can best be understood by 
considering the variations in magnetic, and restoring spring forces with air gap. The 
relative positions of the spring and magnetic force characteristics for three different states 
of the relay, namely, unactuated (in either closed or open state), on the verge of closing 
from the open state, and on the verge of opening from the closed state are shown in Fig. 4, 
5 and 6 respectively. Here the spring characteristic is assumed to be linear. Previous 
studies suggest that the dependence of the magnetic force on the air gap can roughly be 
described by a power law F  gn with an exponent n in the range -1.4 to -2 [28]. When 
there is no coil current, the magnetic force will be solely due to the permanent magnet. 
Depending on the direction of current flow in the coil, the magnetic force can be either 
enhanced or reduced by the electromagnet. In Fig 4, Fs0 = kg0, Fm0 = Rkg0 (say) are the 
spring and magnetic forces respectively when the air gap, g is zero, k is the spring 
stiffness, g1 and g2 are the air gaps corresponding to the two intersection points of the force 
characteristics, g0 is the air gap when the spring is unstressed, and R is the ratio Fm0/ Fs0. 
Note that g1 is a stable equilibrium point whereas g2 is an unstable equilibrium point. In 
the unactuated case, either the relay remains open with air gap g1 or remains closed with 
contact force Fm0 - Fs0.  

Figure 5 shows the effect of increasing the magnetic force by applying a coil current. 
The spring force line is shown to touch the magnetic force curve at the air gap, gt. Any 
further increase in the coil current will cause the relay to close. Figure 6 shows the effect 
of reducing the magnetic force by applying coil current in the opposite direction. Here the 
magnetic force curve is shown to meet the spring force line at g = 0. Any further increase 
in the coil current will cause the relay to open. 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 51

 

Fig. 4: Spring and Magnetic Forces as functions of air gap. 

 

Fig. 5:  Relative position of force characteristics. 

 

Fig. 6: Relative position of force characteristics of microrelay on the verge of latching 
of microrelay on the verge on unlatching. 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 52

When a current pulse of sufficient amplitude and duration is passed through the 
electromagnetic coil, the induced magnetic field due to the permanent magnet and the 
electromagnet in the relay will create sufficient force on the armature to pull the relay 
closed. The relay will stay closed due to the field from the permanent magnet, which is not 
strong enough to pull the relay closed by itself, but will hold it there when the air gap 
becomes small and the flux becomes stronger. To reset the relay, current pulse is applied 
in the opposite direction which will reduce the resultant flux in the air gap sufficiently so 
that the beam can spring back to the open position. 

Another important practical consideration is the ability of the microrelay to withstand 
ambient shock and vibration [29]. It can be shown that greater the area of the closed region 
between the spring and magnetic force characteristics (between g1 and g2) in Fig 4, the 
greater will be the resistance of the microrelay to shock and vibration.  

Thus the following four design rules can be formulated for the microrelay. 

 For latching to occur, the entire magnetic force characteristics for the case of full 
positive electromagnetic actuation should be below the spring force line. 

 Minimum contact force requirement must be satisfied. That is, the magnitude at zero 
air gap of the spring force must be less than the magnitude at zero air gap of the 
magnetic force due to the permanent magnet alone by the minimum contact force 
required. 

 For the switch to unlatch, the magnitude at zero air gap of the spring force must be 
greater than the magnitude at zero air gap of the magnetic force for the case of full 
negative electromagnetic excitation. 

 The area enclosed by the spring and magnetic force characteristics must be sufficiently 
large so as to alleviate the detrimental effects of shock and vibration.  

Parameters of the spring (k and g0), magnetic circuit (n), permanent magnet (Fm0), and 
electromagnetic coil (ampere-turns) should be carefully matched to achieve optimum 
performance. However, manufacturing imperfections associated with MEMS processes 
are likely to result in significant variations in the values of these parameters and severely 
limit the tolerance window of the final product. 

2.2   Microrelay matrices  

While several electromagnetic microrelay designs have been successfully developed 
and commercialized for use as individual units, development work on electromagnetic 
microrelay matrix arrays have been fewer and less successful although many commercial 
applications await them. By combining such relay matrices with electronics, it would be 
possible to perform multiplexing and to reduce the number of electrical lines required to 
switch individual relays in the matrix; an 88 array for instance would require 16 control 
lines, as opposed to 64 control lines when the relays are packaged separately without the 
multiplexing electronics. Such relay arrays have great potential in the telecommunication 
industry. 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 53

While individual microrelays can be made to operate reliably, making micro relay 
matrix arrays in which individual relays need to be selectively and reliably switched on 
and off by an appropriate multiplexing scheme presents many challenges. The major 
problem is the difficulty in achieving the degree of uniformity in the structural dimensions 
among the individual relays in the matrix. It is difficult to achieve close dimensional 
tolerances of micro relay structures when cost effective MEMS fabrication methods are 
used. Due to the inherent limitations of the micromachining processes, significant 
variations in the dimensions of the micro relay occur across the wafer. For example, each 
individual microrelay may not have the same thickness of cantilever beam and the initial 
air gap. Besides, stiction problem, which occurs when two nominally flat surfaces are 
placed in contact also contribute to unreliability of the switching action [30].  Due to these 
reasons, each individual relay in a matrix will have varying electrical, magnetic and 
mechanical properties, and as a result the strength of the control signals required for 
switching the relays on and off is bound to vary widely.  A small variation of +5% in the 
thickness of the cantilever, for instance, would result in +15% variation in the spring 
parameter k. This could cause serious switching errors in the relay matrix.  Experience of 
two of the authors of this paper suggests that micro relay matrix arrays based on 
microrelay designs outlined in section 2.2 is bound to have very narrow tolerance window 
and hence very low reliability. 

2.3 Alternative design concepts 

The most interesting of all electromagnetic microrelay designs that have been reported 
to date is MagLatchTM  which has been commercialised by Magfusion [31]. The major 
advantage of this relay is the latching mechanism to maintain the non-volatile state 
without requiring constant current supply. The device is based on preferential 
magnetization of a permalloy cantilever in a permanent external magnetic field. Switching 
between two stable states is achieved by sending a short current pulse through an 
integrated coil underneath the cantilever. However, suitability of this design for the 
fabrication of integrated microrelay arrays with viable, cost effective row and column 
addressing scheme is yet to be demonstrated. 

A major drawback of the conventional design discussed in Section 2.1 is the variability 
associated with the initial air gap and thickness of the cantilever. Any stress induced in the 
cantilever beam during the electroplating process is likely to cause some initial deflection 
in the cantilever and variable air gap. The stiffness of the cantilever spring varies as the 
cube of its thickness, implying that the stiffness variation would be about three times the 
thickness variation. As the heavier armature at the end of the cantilever is not fixed when 
the relay is in the off state, resistance of the device to shock and vibration is bound to be 
low.  

To alleviate these problems, Roshen et al. [32] proposed a micromachined 
electromagnetic switch with fixed on and off positions using two soft magnets and one 
permanent magnet as shown schematically in Fig. 7(a). Two soft magnets situated in fixed 
positions above and below a permanent magnet toggles between two fixed positions by the 
application of current in an actuator coil for a brief period. The permanent magnet is 
attached to a micromachined hinge or spring which moves under the action of a net force, 
thereby opening or closing the switch. Current in the actuator coil changes the relative 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 54

strength of the magnetic forces due to the soft magnets. In the absence of current in the 
actuator coil, the switch is kept in the open or closed position by the attractive magnetic 
force between the permanent magnet and either the upper or lower soft magnet, whereby 
the stronger force is exercised between the permanent magnet and the nearest soft magnet.  

In the conventional electromagnetic microrelay design, the strain energy stored in the 
spring when the relay is in the closed state is not gainfully utilised. When the relay is 
switched open from its closed state, the stored energy is transformed into kinetic energy 
and manifests as oscillations which eventually dies down due to damping. 

 

(a) Fixed on-off position switch (b)  Bistable switch 

Fig. 7: Schematic designs of bistable, latching, electromagnetic switch. 

Tabat et al. [33] proposed a novel design, shown schematically in Fig. 7(b) that utilises 
the stored energy in the switch for changing its state. Bistable operation is obtained using a 
single coil and a magnetic core with a gap. A plunger having two magnetic heads is 
supported for back and forth linear movement with respect to the gap in the core. The 
single electrical coil is coupled to the core and is provided with electrical current to attract 
one of the heads toward the core by reluctance action and drive the plunger to the limit of 
travel in one direction. The current is then cut off and the plunger returns by spring action 
toward the gap, where after the current is reapplied to the coil to attract the other head of 
the plunger to its limit of travel. This process can be repeated at a time when switching of 
the actuator is required. 

While the above two novel concepts have significant merits and are worth pursuing, 
one has to bear in mind the difficulties of micromachining such devices. To the authors’ 
knowledge, an economically viable design utilizing one or more of these two concepts that 
is amenable to micromachining remains to be developed. 

3. DISCUSSION OF ONGOING RESEARCH AT RMIT 
UNIVERSITY 

A group of researchers at RMIT University are attempting to develop a robust design 
for an electromagnetic microrelay that can form the building block of microrelay array 
matrices. The main focus is to develop a relay structure with the following features: easily 
manufacturable by standard MEMS processes with minimum cost, has fixed on and off 
positions so that resistance to shock and vibration can be enhanced, utilizes the strain 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 55

energy stored in the spring for switching from one state to the other resulting in a more 
positive switching action, uses a permanent magnet to achieve latching as well as push-
pull action during switching.  

3.1 Proposed design of electromagnetic micro relay 

The proposed design under study is shown schematically in Fig. 8(a) and (b). A 
relatively thick and rigid beam is attached at two points to the free ends of two thin 
cantilever beams as in Fig. 8(c). These can be made of Silicon or a low permeability 
material such as electroplated Nickel. An important feature of this mechanical 
arrangement is that the elastic support provided by the pair of cantilever beams is very stiff 
for pure vertical movements of the rigid beam (due to axial stiffening of the cantilever 
beams), but quite flexible for tilting movements as shown in Fig 8(d). Furthermore, in the 
tilted position the mechanical system once again becomes quite stiff if the lower end of the 
rigid beam is held against a mechanical stop, as in Fig. 8(e). Two permanent magnets are 
attached to the ends of the rigid beam and magnetized in a vertical direction as shown. The 
electromagnet is formed by a number of planar parallel wires all carrying current in the 
same direction (normal to the plane of the paper). The Permalloy strip is placed 
underneath the wires to increase the magnetic flux due to the current carrying wires. It is 
to be noted that, even without the two permanent magnets, bistable operation similar to the 
device of Fig. 8(b) is possible with this design. 

When a current pulse is applied to the coil (in a direction along the outward normal to 
the paper), the RHS permalloy pole piece will be polarized N and the other S, attracting 
the LHS end of the rigid beam while repelling the RHS end, and causing the beam to tilt 
counter clockwise. When the coil current is switched off, the magnetic attraction between 
the LHS permanent magnet and the LHS permalloy pole piece will be able to hold the 
rigid beam to remain in the tilted position. A current pulse in the opposite direction will 
cause the rigid beam tilt to the opposite side. 

 

Fig. 8:  Schematic of the proposed mechanical system 

 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 56

3.2 Finite Element Analysis (FEA) 

To realistically study the mechanical system, a simple linear analysis will not suffice; 
nonlinear effect of stiffening of the beam caused by deflection will have to be accounted 
for.  Using ANSYS software, a nonlinear finite element analysis is carried out to 
determine the force-deflection characteristics of the proposed structure. Figure 9 gives the 
normalized force – deflection characteristics of the LHS end of the rigid beam when the 
RHS end of the beam is held down against a normalized dead stop distance, dn below the 
undeflected position of the beam. At positive normalized forces (upward), the graph 
demonstrates for higher values of dn, the characteristics display a very flat region which 
implies the increasing stiffness of the system. However, beyond a certain threshold values 
of the applied force, the deflection steadily increases with force. For example, for dn = 
0.042, the graph is nearly constant between the normalized force of 0.00 to 0.02, but when 
it reached the threshold value at around 0.03, the deflection increase significantly.  It 
appears that buckling of the cantilever beams occur beyond this threshold. 

This trend repeats for the negative forces (downward forces) at small value of dn for 
example, dn =0.008. Generally, the FEA results show flat regions in terms of normalized 
deflection which demonstrates high degree of stiffness when downward forces are applied. 
It can therefore be concluded that within the limits set be the threshold, the mechanism 
offers significant disturbance immunity. 

Some preliminary analysis of the magnetic circuit of the microrelay has also been done 
performed to determine the force generated on the rigid beam by the electromagnet at 
various positions of the rigid beam. The magnetic circuit simulated is shown in Fig. 10(a). 
In this analysis the permanent magnets are left out and the rigid beam is assumed to be 
made up of a high permeable material such as electroplated permalloy. The objective is to 
see whether bistable operation is possible with such an arrangement. The element type 
PLANE13 is used to model the magnetic circuit, cantilever beam, air gap and the coil, 
while two-dimensional four node boundary elements, INFIN110, are used to simulate an 
infinite extension of the surrounding air. The flux patterns for initial horizontal beam 
position and for a tilted position are shown in Fig. 10(b) and Fig. 10(c). Effect of the tilt 
angle on the resultant force and its point of application are analysed and the results 
presented in Table 2. 

 It can be seen from Table 1 that as the angle of tilt of the rigid beam increases the point of 
application of the resultant magnetic force moves further to the right of the beam centre. 
The normalized force and the tilting moment also increase with the angle of tilt. Graph in 
Fig. 11 demonstrates that bistable operation under electromagnetic excitation is feasible 
provided the spring force line lies below the magnetic force line. 

Table 1:  Magnetic force on beam at tilted angle 

Tilted angle,  

θ 

Normalised force 

(Fθ/F0) 

Normalised offset 

(e/l) 

Normalised tilting moment 

(Fθe/ F0l) 

0 1.00 0.00 0 

5 1.04 0.17 0.1768 

10 1.22 0.33 0.4026 

15 1.78 0.54 0.9612 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 57

 

Fig. 9:  Force – deflection characteristics of the LHS end when RHS end is pressed 
down against a dead stop distance d below the undeflected position of rigid beam. 

 
 (a ) 

  
(b) (c) 

 

Fig. 10: FEA of magnetic circuit and the magnetic flux patterns for horizontal and tilted 
position  



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 58

 
Fig. 11: Tilting moment at different angle 

4. SUMMARY 

Because of their narrow tolerance window, existing designs of electromagnetic 
microrelays are proving to be problematic for fabricating microrelay matrices where 
individual relays are required to be selectively switched on and off by row and column 
multiplexing. A novel design incorporating a number of desirable features to improve 
switching robustness is proposed. ANSYS simulation studies are being pursued to 
demonstrate the advantages of the proposed design. A prototype is to be built and 
evaluated in the near future. 

REFERENCES 

[1] M. J. Madou, Fundamentals of Microfabrication: The Science of Miniaturization, CRC Press. 
2nd  Edition, 2002. 

[2] S. D. Senturia, Microsystem Design, Springer, 2004. 
[3] J. A. Pelesko and D. H. Bernstein, Modeling MEMS and NEMS, CRC Press, 2002.  
[4] H. F. Schlaak, “Potential and Limits of Micro-electromechanical Systems for Relay and 

Switches”, in Proc. 21st  International Conference on Electrical Contacts, Zurich, pp. 19-30, 9-
12 Sep, 2002.  

[5] R. H. Grace, “Commercialization Issues of MEMS/MST/Micromachines, An Updated Industry 
Report Card on the Barriers to Commercialization”, in Proc. Of Sensors Expo & Conference, 
Boston, 23-26 Sep, 2002. 

[6] W. Johler, “ Switching Contacts for Low Level Applications-An Overview”, in Proc. 21st  
International Conference on Electrical Contacts, Zurich, pp. 19-30, 9-12 Sep, 2002. 

[7] K. E. Petersen, “Microelectromechanical Membrane Switches on Silicon. IBM J. Res. Dev., 24, 
pp. 376-385, 1979. 

[8] J. Schimkat, “Contact Materials for Microrelays” in Proc. The Eleventh Annual International 
Workshop on MEMS 98, pp. 190-194, 25-29 Jan, 1998. 

[9] G. B Chong et al., “Simulations Based Design for a Large Displacement Electrostatically 
Actuated Microrelay”. Analog Integrated Circuits and Signal Processing, 32, pp. 37-46, 2002. 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 59

[10] H. S. Lee, “Integrated Microrelays: Concept and Initial Results”, Journal of 
Microelectromechanical Systems. Vol 11, No.2, pp. 147-153, 2002. 

[11] J. Kim, “A Micromechanical Switch with Electrostatically Driven Liquid-Metal Droplet”. 
Sensors and Actuators A , vol. 97-98, pp. 672-679, 2002.  

[12] J. Qiu et al.  “ A High-Current Electrothermal Bistable MEMS Relay”, n Proc. Of Micro 
Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual 
International Conference, pp. 64-67, 19-23 Jan. 2003.  

[13] Y. Wang et al., “A micromachined RF microrelay with electrothermal actuation”, Sensors and 
Actuators A: Physical, Vol. 103, Issues 1-2, pp. 231-236, 2003.  

[14] T. Moulton and G. K. Ananthasuresh, “Micromechanical devices with embedded electro-
thermal-compliant actuation”, Sensors and Actuators A: Physical, Vol. 90, Issues 1-2, pp. 38-48, 
2001.  

[15] G. D. Gray, Jr. and P. A Kohl, “Magnetically bistable actuator: Part 1. Ultra-low switching 
energy and modelling”. Sensors and Actuators A: Physical, Vol. 119, Issue 2, pp. 489-501, 
2005. 

[16] J. W. Judy, “Batch-Fabricated Ferromagnetic Microactuators With Silicon Flexures”. Doctoral 
Dissertation, University of California, Berkeley, 1996. 

[17] I. J. Busch-Vishniac, “The case of magnetically driven microactuators”, Sensor and Actuators, 
vol 33, pp. 207-220, 1992. 

[18] G. Reyne, “Electromagnetic actuation for MOEMS, examples, advantages and drawbacks of 
MAGMAS”, Journals of Magnetism and Magnetic Materials, vol. 242-245, pp. 1119-1125, 
2002. 

[19] D. Niarchos, “Magnetic MEMS: key issues and some applications,” Sensors and Actuators A,  
vol. 109, pp. 166-173, 2003. 

[20] L. K. Lagorce, O. Brand and M. G. Allen, “ Magnetic Microactuators Based on Polymer 
Magnets”, IEEE Journals of Microelectromechanical Systems, vol. 8, no.1, 1999. 

[21] H. Hosaka, H. Kuwano and K. Yanagisawa, “Electromagnetic microrelays: Concept and 
fundamental characteristics”, in Proc. IEEE Microelectromechanical Sys. Conf., Fort 
Lauderdale, pp. 41-47, 1993. 

[22] J.A Wright and Y. C. Tai, “ Micro-miniature Electromagnetic Switches Fabricated Using 
MEMS Technology”, Proceedings: 46th Annual Relay Conference: NARM ’98,  Illinois, pp. 
13-1 to 13-4, April, 1998. 

[23] H. Hosaka and H. Kuwano, “Design and fabrication of miniature relay matrix and investigation 
of electromechanical interference in multi-actuator systems” MEMS '94, Proceedings, IEEE 
Workshop,  pp. 313 – 318, 25-28 Jan. 1994. 

[24] W. P. Taylor and M.G. Allen, “Integrated Magnetic Microrelays: Normally Open, Normally 
Closed, and Multi-Pole Devices”, in Transducers ’97, International Conference on Solid-State 
Sensors and Actuators, Chicago, pp.1149-1152, 16-19 Jan, 1997. 

[25] E. Fullin et al., “A New Basic Technology for Magnetic Micro-actuators”, 
Micro Electro Mechanical Systems, 1998. MEMS 98. Proceedings., The Eleventh Annual 
International Workshop , pp.143–147, 25-29 Jan.1998.  

[26] H.A. C. Tilmans et al. “ Fully-Packaged Electromagnetic Microrelay”,  Micro Electro 
Mechanical Systems, 1999,  Twelfth IEEE International Conference on MEMS '99, pp. 25 - 
30, 17-21 Jan. 1999. 

[27] T. Masood, “Microactuators : electrical, magnetic, thermal, optical, mechanical, chemical & 
smart structures”, Boston : Kluwer Academic, 1998. 

[28] W.P. Taylor, O. Brand and M.G. Allen, “Fully Integrated Magnetically Actuated Micromachined 
Relays”, Journal of Microelectromechanical Systems, Vol. 7, No. 2, June 1998. 



IIUM Engineering Journal, Vol. 6, No. 2, 2005 Z. Dahari et al. 

 60

[29] K. Persson, “Fundamental Requirements on MEMS Packaging and Reliability”, 8th 
International Symposium on Advanced Packaging Materials”, 2002.  

[30] A. Witrouw, H.A.C Tilmans and I.De Wolf, “Material issues in the processing, the operation 
and the reliability of MEMS”, Microelectronic Engineering, vol. 76, pp. 245-257, 2004. 

[31] http://www.magfusion.com 
[32] US Patents, 05475353. 
[33] US Patents, 5,808,384.