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Proceedings of Engineering and Technology Innovation , vol. 4, 2016, pp. 19 - 21 

19 

A Way to Introduce Innovative Approach in the Field of  

Microelectronics and Nanotechnologies in the Chinese  

Education System 

Olivier Bonnaud
1,2,3,*

, Lei Wei
3
 

1
Department of microelectronics and microsensors, IETR, University of Rennes 1, Rennes , France. 

2
National Coordination for Education in Microelectronics and Nanotechnologies, Grenoble, France . 

3
Department of Electrical Engineering, South -East University, Nanjing (Jiangsu), China. 

Received 22 February 2016; received in revised form 21 March 2016; accept ed 10 April 2016 

 

Abstract 

The innovation is more and more useful in  

order to develop new products such as the con-

necting objects. The field of microe lectronics is 

particularly concerned by them since it co m-

bines the fast evolution of the technology, and 

their application to many domains. The educ a-

tive system in China is ma inly based on me mo-

rization o f knowledge: the students are lac king  

of methodology, understanding and practice. In  

the same time, the pedagogy in higher education 

moves progressively towards a numerical ap-

proach. In this context, the ma in challenge is to 

give to the students, the methodology, the 

know-how, and thus an innovative behaviour. In 

this way, several suggestions are given: intro-

duction of much more works on applications of 

the theoretical knowledge, tra ining on the lin k-

ing of knowledge, and imp rovement of the  

practice by laboratory works on dedicated pla t-

forms. 

Keywor ds : innovation, higher education, mi-

croelectronics , practice and lab-

works. 

1. Introduction 

The economica l world encourages  more and  

more  innovation in order to develop new prod-

ucts that should answer to the future societal 

needs, more especially the connecting objects. 

The fie ld of microelectronics is particularly  

concerned because these objects combine the  

strong improvement of the microe lectronics 

technologies , and the application to  many d o-

ma ins. In the sa me time, the pedagogy in higher 

education shifts  towards a numerica l world by  

involving tools based on Massive Open Online  

Courses (MOOCs), internet sites, modelling and 

simu lation. The ma in  challenge is to g ive to the  

future engineers, the methodology and the 

know-how, wh ich is not enough provided 

nowadays, and thus an innovative approach. The 

pedagogical approach in Ch ina, fro m the pri-

ma ry school to the University, is based on the 

learning of knowledge, main ly. The evaluation 

and the selection are based on the me morization  

as well. Several weaknesses are revealed. This 

paper highlights these points and suggests  sev-

eral improve ments in order to give to the future 

engineers an innovative behavior in the fie ld of 

microelectronics . 

2. Situation of the Higher Education 

in China 

The previous experience in China of the  

authors shows that the basic education presents 

several weakness es in the pedagogical method-

ology. On  the one hand, in  the learning of basic  

knowledge since  the primary  school, the pupils, 

then the schoolers, and finally the students are 

spending a lot of time learning by heart a diffi-

cult language, and, with the same approach, the 

scientific background (mathemat ics, physics, 

chemistry, etc.). On the other hand, they have a 

low a mount of practice, inc luding applications 

of theories through resolution of problems, and a 

very lo w a mount of laboratory works. But this  

practice is revealed very effic ient to assimilate  

more  the methodology and the logical de mo n-

strations than the theoretical knowledge. If the  

me mo rizat ion by heart is efficient to g ive to the  

* Corresponding aut hor.  
Email: Olivier.bonnaud@univ-rennes1.fr 



Proceedings of Engineering and Technology Innovation , vol. 4, 2016, pp. 19 - 21 

20 Copyright ©  TAETI 

students the good capacities of communication  

in their national language, however the students 

lack a  general approach that allows a  deep u n-

derstanding of a scientific fie ld, and also the link 

of knowledge between several fields. 

In the fra me of 1000 Ta lents program of 

China’s Govern ment, an analysis of the situation 

in the fie ld of M icroe lectronics raises  additional 

weaknesses, specific to  this field. Indeed, due  

the very e xpensive equipment for devices and 

circuits, the students have in average a very poor 

know-how. In addition, because this domain has 

a permanent and very fast evolution, the practice 

can be always obsolete if an innovative strategy 

is not applied by the institutions and their ed u-

cational departments. These weaknesses give 

rise to some suggestions that can imp rove the 

efficiency of the acquisition of skills in this 

domain. 

3. Evolution of the Technologies 

The very fast evolution of the microelec -

tronics integration since more than forty years is 

well known and is called the Moore’s law [1]. 

This heuristic indicates  the decrease of the 

transistor size as a time function thanks to the 

tremendous  improvement of the technological 

fabrication processes and to the huge increase of 

the performances of the co mputer tools and 

associated software. These improve ments have 

later opened the doors to the system integration, 

called  the “More than Moore" evolution [ 2]. It  

corresponds today to an increase of the co m-

ple xity by combining several technologies and 

the packaging capabilities , by mixing other 

functions than electrical ones , and by designing 

the ele mentary devices and the integrated cir-

cuits in three dimensions . This evolution in-

duced new generic technologies such as mech a-

tronics, optoelectronics, bioelectronics, sys-

tems -on-chips, large area electronics, etc. that 

combine skills in several fie lds and that are 

intrinsically mu ltidiscip linary [3]. Indeed, these 

new concepts are already applied main ly to the 

sectors of health, environ ment, security, energy, 

agriculture, transport, and commun ications, 

which a re considered as the first priority for our 

future technological societies. Thanks to the  

concomitant strong evolution of the commun i-

cations, through internet, through wireless 

communicat ions  such as Wifi, Zig Bee, Blue-

tooth, 3G, 4G, cloud, etc., it is predicted a fast 

evolution towards connecting objects in a ll the  

mentioned applications. Many reports made by  

international e xpe rts highlight this evolution for 

the next ten years [4]. 

4. Innovation Approach Linked to 

Microelectronics  

For the design of these connecting objects , 

the engineers in research and development 

centers must combine the knowledge and the 

know-how of several fields and must be inno-

vative. This innovation may co me by the cap a-

bilities of the designers  to analyze the econom-

ical and societal needs , to make links between 

technologies, to extract the concepts of existing 

applications, to apply the selected concepts of 

one field to another one. All these qualities and 

know-how should be initiated during the studies . 

In other words, this means a  high knowledge and  

the know-how that allows the control of the 

limitat ions of the systems, the definit ion of the  

adapted mission profiles, the control of the 

security of the equipment and of the effective  

application, and the reliability as well. 

This supposes during the studies a very good 

background in scientific  disciplines, a good 

training including pract ice and laboratory works, 

and a mult idisciplinary approach  including the 

capacity to establish links between the different  

fie lds (commun ications between engineers, 

understanding of the concepts, etc.). 

5. Expected Evolution of the Higher 
Education 

Many governments of developed countries 

try to develop the numerica l approach of many  

branches of the economy, and more especially  

the education one. Thanks to the huge increase 

of the performances of the dig ital tools associ-

ated to the powerful co mputing capabilities of 

the hardware (microprocessors, DSP, etc.), to  

the size of the software, new educative tools can 

be created. They can contain texts, pictures, 

animations , videos , but also simu lations and 

modeling. If these tools can be really useful to  

ma ke easier the co mprehension of the basic 

knowledge, they appear insuffic ient to under-

stand the methodology, to make links between 

knowledge and above all they rema in virtual. 

The functioning of connecting objects is  often 

very different fro m the one of virtual objects . 

The main reason is the comple xity of the env i-

ronment that can affect the functioning of a 



Proceedings of Engineering and Technology Innovation , vol. 4, 2016, pp. 19 - 21 

21 Copyright ©  TAETI 

product, for e xa mple , effects of the temperature, 

the pressure, the chemica l environ ment, etc. The  

natural environment is so much comple x that it  

is very difficult to guarantee that a simulator 

takes all the para meters into account! Thus a 

comple mentary practice is mandatory in order to 

well understand the limitat ions , the range of the  

physical para meters, and the mission profile . 

This practice is also a way to better e xpla in the 

fundamental background, to give a know-how in  

real situations that is a key approach to develop 

the skills of analysis, of synthesis, of ma king  

lin ks between several disciplines. This approach 

allo ws the building of an innovative behavior of 

the students.  

6. Suggestion of Evolution of the 

Chinese Higher Education 

Many suggestions can be made in order to 

improve the innovative approach [5]. We mention 

those that can be the most efficient in the present 

situation. The first concerns the methodology of 

teaching that should not be mainly based on 

me morization but that could include problem 

solving, cases studies of real objects and their 

limitations of functioning. The second point is 

focused on the need of practice. In the field of 

microelectronics, due to the high costs of the 

software and of the technological facilities, the 

set-up of common platforms should give a solu-

tion. This approach was developed in France 

since many years in the frame of a national net-

work [6-7]. T welve national centers receive more 

than 14.000 students per year in technological 

cleanrooms, on benches of physical and electrical 

characterizations, on platforms of modeling, 

simulation, and computer-aided design. Moreo-

ver, an innovative strategy of the network is 

applied through annual projects in order to 

maintain an up-to-date training. 

7. Conclusions 

Several weakness es were observed in the 

Chinese education system: they seem to have an 

important impact on the learning of the mic roe-

lectronics discipline. The introduction of new 

approaches that include much mo re analyses, 

understanding and acquisition of know-how 

should lead to  a mo re e ffic ient lea rning adapted 

to the permanent innovation needed in this 

domain. 

Acknowledgement 

This work is  supported by the French Min-

istry of Education, the Ch inese 1000 Talents 

program, and the French Excellence Init iative  

program IDEFI (A NR-11-IDFI-0017 (2012)). A  

special thanks to L. Chagoya-Ga rzon, secretary 

of GIP-CNFM for her fru itful advice for the  

redaction of this paper. 

References 

[1] G. E. Moore, “Cramming more components 
onto integrated circuits ,” Electronics Maga-

zine, vol. 38, no. 8, pp.114-117, 1965. 

[2] W. Arden, et al. editors “More-than- Moore,” 
International Roadmap Committee of ITRS, 

White Paper, 2010. 

[3] O. Bonnaud, L. Fesquet, “Multidisciplinary 
topics for the innovative education in micro-

electronics and its applications ,” Proc. IEEE 

Intern. Conf. on Information Technology 

Based Higher Education and Training 

(ITHET’15), 11-13 June, 2015, pp. 1-5. 

[4] J. Dokic, B. Müller, G. Meyer, “Strategic res -
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[5] O. Bonnaud, “Difference of pedagogical 

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students in a French-Chinese microelectronics 

joint master diploma,” Proc. IEEE Intern. 

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[6] O. Bonnaud, P. Gentil, et al., “GIP-CNFM: A  
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croelectronics to nanotechnologies ,” Proc. 

IEEE Global Engineering Education Confer-

ence (EDUCON’11), 3-6 April 2011, pp. 

122-127. 

[7] “National coordination for education in micr-
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ww.cnfm.fr, May 2016.